Inventor · disambiguated record
Tsuyoshi Kamimura
Also filed as: KAMIMURA TSUYOSHI
2 granted patents·4 pending applications·0 citations·filing 2018–2024
22Inventor score
Technology areasH10W
Top patents by PatentIndex Score
6 records- 0159US2025026920A1Liquid epoxy resin composition for use as mold underfill material for tsvSK HYNIX INC·Filed 2024·Application pending·0 cites
- 0249US2024368374A1Epoxy resin composition, liquid compression mold material, glob-top material, and semiconductor deviceNAMICS CORP·Filed 2022·Application pending·0 cites
- 0346US2025178245A1Liquid compression molding material, electronic component, semiconductor device and method for producing semiconductor deviceNAMICS CORP·Filed 2022·Application pending·0 cites
- 0444US2023203236A1Liquid compression molding materialNAMICS CORP·Filed 2021·Application pending·0 cites
- 0541US12454612B2Liquid resin composition for compression molding and electronic component apparatusHITACHI CHEMICAL CO LTD·Filed 2018·Granted Oct 28, 2025·0 cites·10 claims
- 0638US12131970B2Liquid resin composition for sealing and electronic component apparatusHITACHI CHEMICAL CO LTD·Filed 2018·Granted Oct 29, 2024·0 cites·20 claims
Join the waitlist — get patent alerts
Get an alert when Tsuyoshi Kamimura files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →