Inventor · disambiguated record
Tsukasa Katsuyama
Also filed as: KATSUYAMA TSUKASA
3 granted patents·2 pending applications·1 citations·filing 2016–2020
48Inventor score
Files withTAMURA SEISAKUSHO KK5
Top patents by PatentIndex Score
5 records- 0165US10926360B2Lead-free solder alloy, solder joint, solder paste composition, electronic circuit board, and electronic deviceTAMURA SEISAKUSHO KK·Filed 2017·Granted Feb 23, 2021·1 cites·17 claims
- 0251US10456872B2Lead-free solder alloy, electronic circuit substrate, and electronic deviceTAMURA SEISAKUSHO KK·Filed 2017·Granted Oct 29, 2019·0 cites·11 claims
- 0347US11724341B2Lead-free solder alloy, solder joining material, electronic circuit mounting substrate, and electronic control deviceTAMURA SEISAKUSHO KK·Filed 2020·Granted Aug 15, 2023·0 cites·7 claims
- 0434US2016279741A1Lead-free solder alloy, electronic circuit board, and electronic control deviceTAMURA SEISAKUSHO KK·Filed 2016·Application pending·0 cites
- 0534US2019210161A1Lead-free solder alloy, solder paste, and electronic circuit boardTAMURA SEISAKUSHO KK·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →