Inventor · disambiguated record
Tsuyoshi Kida
Also filed as: KIDA TSUYOSHI
23 granted patents·8 pending applications·183 citations·filing 1999–2020
94Inventor score
Files withRENESAS ELECTRONICS CORP10MITSUBISHI GAS CHEMICAL CO7NEC ELECTRONICS CORP6SAKATA KENJI3KIDA TSUYOSHI1
Top patents by PatentIndex Score
31 records- 0192US9917026B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2014·Granted Mar 13, 2018·13 cites·20 claims
- 0290US8710651B2Semiconductor device and method for manufacturing the sameSAKATA KENJI·Filed 2010·Granted Apr 29, 2014·15 cites·15 claims
- 0387US6313540B1Electrode structure of semiconductor elementNEC CORP·Filed 1999·Granted Nov 6, 2001·108 cites·3 claims
- 0486US7554211B2Semiconductor wafer and manufacturing process for semiconductor deviceNEC ELECTRONICS CORP·Filed 2005·Granted Jun 30, 2009·13 cites·16 claims
- 0582US10312199B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2018·Granted Jun 4, 2019·3 cites·6 claims
- 0677US9349678B2Chip having a pillar electrode offset from the bonding padRENESAS ELECTRONICS CORP·Filed 2015·Granted May 24, 2016·3 cites·18 claims
- 0775US10141273B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2014·Granted Nov 27, 2018·3 cites·13 claims
- 0875US7545024B2Laser beam processing apparatus for processing semiconductor wafer in production of semiconductor devices, laser beam processing method executed therein, and such semiconductor wafer processed therebyNEC ELECTRONICS CORP·Filed 2005·Granted Jun 9, 2009·4 cites·2 claims
- 0972US9905529B2Method for manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2016·Granted Feb 27, 2018·2 cites·13 claims
- 1071US7829439B2Laser beam processing method for making a semiconductor deviceNEC ELECTRONICS CORP·Filed 2008·Granted Nov 9, 2010·3 cites·3 claims
- 1168US10347552B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2018·Granted Jul 9, 2019·1 cites·13 claims
- 1268US8002542B2Heat treatment jig and heat treatment jig setRENESAS ELECTRONICS CORP·Filed 2007·Granted Aug 23, 2011·1 cites·11 claims
- 1367US8404517B2Semiconductor device and method of manufacturing the sameSAKATA KENJI·Filed 2012·Granted Mar 26, 2013·2 cites·14 claims
- 1466US8207619B2Semiconductor device and method of manufacturing the sameSAKATA KENJI·Filed 2010·Granted Jun 26, 2012·2 cites·14 claims
- 1566US7759223B2Semiconductor wafer and manufacturing process for semiconductor deviceNEC ELECTRONICS CORP·Filed 2009·Granted Jul 20, 2010·2 cites·13 claims
- 1663US9054093B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2014·Granted Jun 9, 2015·1 cites·7 claims
- 1762US10808103B2Resin composition, laminate including the resin composition, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer, and semiconductor device including the semiconductor wafer with resin composition layerMITSUBISHI GAS CHEMICAL CO·Filed 2017·Granted Oct 20, 2020·1 cites·19 claims
- 1860US8067835B2Method and apparatus for manufacturing semiconductor moduleKIDA TSUYOSHI·Filed 2008·Granted Nov 29, 2011·3 cites·12 claims
- 1948US12195566B2Film, laminate, semiconductor wafer with film layer, substrate for mounting semiconductor with film layer, and semiconductor deviceMITSUBISHI GAS CHEMICAL CO·Filed 2020·Granted Jan 14, 2025·0 cites·33 claims
- 2047US7514800B2Semiconductor device and wire bonding method thereforNEC ELECTRONICS CORP·Filed 2002·Granted Apr 7, 2009·3 cites·6 claims
- 2147US2007278677A1Semiconductor module featuring solder balls having lower melting point than that of solder electrode terminals of passive element deviceNEC ELECTRONICS CORP·Filed 2007·Application pending·0 cites
- 2246US2015179623A1Method for manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2014·Application pending·0 cites
- 2346US2015179615A1Semiconductor device and method for manufacturing the sameWATANABE SHINJI·Filed 2014·Application pending·0 cites
- 2445US11935803B2Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer and semiconductor deviceMITSUBISHI GAS CHEMICAL CO·Filed 2019·Granted Mar 19, 2024·0 cites·27 claims
- 2545US2015243614A1Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Application pending·0 cites
- 2643US2007246818A1Semiconductor module featuring solder balls having lower melting point than that of solder electrode terminals of electronic device containing additional metal powder componentNED ELECTRONICS CORP·Filed 2007·Application pending·0 cites
- 2738US2022389130A1Film, laminate, semiconductor wafer with film layer, substrate for mounting semiconductor with film layer, and semiconductor deviceMITSUBISHI GAS CHEMICAL CO·Filed 2020·Application pending·0 cites
- 2835US2015236003A1Method of manufacturing semiconductor deviceKONNO JUMPEI·Filed 2012·Application pending·0 cites
- 2934US11924979B2Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer and semiconductor deviceMITSUBISHI GAS CHEMICAL CO·Filed 2019·Granted Mar 5, 2024·0 cites·26 claims
- 3034US11053382B2Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer, and semiconductor deviceMITSUBISHI GAS CHEMICAL CO·Filed 2017·Granted Jul 6, 2021·0 cites·22 claims
- 3134US2021147680A1Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer, and semiconductor deviceMITSUBISHI GAS CHEMICAL CO·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →