Semiconductor device

Abstract

A semiconductor chip and a wiring board are coupled to each other through conductor posts. The centers of conductor posts situated above openings at the outermost periphery shift from the centers of the openings in a direction away from the center of the semiconductor chip. When a region where each of the conductor posts and an insulating layer are overlapped with each other is designated as an overlapped region, the width of the overlapped region more on the inner side than the opening is smaller than the width of the overlapped region more on the outer side than the opening. Thus, while stress applied to the conductor posts is relaxed, coupling reliability between the semiconductor chip and the wiring board is retained.

1 . A semiconductor device comprising:
 a wiring board having a plurality of electrodes, and   a semiconductor chip which is mounted over the wiring board and coupled to the electrodes via solder,   wherein the semiconductor chip includes a rectangular substrate, an insulating film which is formed over the substrate, a plurality of openings which are formed in the insulating film and arranged along the first side of the substrate, a plurality of electrode pads which are situated in the respective openings, and conductor posts which are formed over the respective electrode pads and coupled to the solder and at least part of the periphery of each of which is situated over the insulating film;   wherein when a region where each of the conductor posts is overlapped with the insulating film is designated as an overlapped region, a first width which is the width of the overlapped region situated on a first straight line extending from the center of a first conductor post closest to one end of the first side as a starting point to the center of the substrate as an end point is smaller than a second width which is the width of the overlapped region on an extension line extending in a direction passing through the center of the first conductor post of the first straight line, and   wherein a second straight line passing through the center of the first conductor post and the center of a first opening overlapped with the first conductor post and the first side intersect with each other at an angle other than 90°.   
     
     
         2 - 7 . (canceled)