Inventor · disambiguated record
Tsung-Jen Liao
Also filed as: LIAO TSUNG JEN
18 granted patents·6 pending applications·37 citations·filing 2009–2022
90Inventor score
Top patents by PatentIndex Score
24 records- 0186US8240882B2Light emitting diode module and method for making the sameLIAO TSUNG-JEN·Filed 2010·Granted Aug 14, 2012·13 cites·21 claims
- 0282US10679877B2Carrier tape system and methods of using carrier tape systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 9, 2020·2 cites·20 claims
- 0381US8836144B2Wafer level package structureCHIPMOS TECHNOLOGIES INC·Filed 2013·Granted Sep 16, 2014·5 cites·13 claims
- 0479US9269643B2Chip package structureCHIPMOS TECHNOLOGIES INC·Filed 2014·Granted Feb 23, 2016·4 cites·8 claims
- 0574US9437542B2Chip package structureCHIPMOS TECHNOLOGIES INC·Filed 2015·Granted Sep 6, 2016·2 cites·18 claims
- 0672US9087912B2Method for wafer level packaging and a package structure thereofCHIPMOS TECHNOLOGIES INC·Filed 2014·Granted Jul 21, 2015·3 cites·20 claims
- 0769US8154029B2Planar light source deviceLIAO TSUNG-JEN·Filed 2009·Granted Apr 10, 2012·6 cites·10 claims
- 0867US11164764B2Carrier tape system and methods of using carrier tape systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 2, 2021·0 cites·20 claims
- 0967US11164763B2Carrier tape system and methods of using carrier tape systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 2, 2021·0 cites·20 claims
- 1062US12159847B2Integrated fan-out structures and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 3, 2024·0 cites·20 claims
- 1161US9123684B2Chip package structure and manufacturing method thereofCHIPMOS TECHNOLOGIES INC·Filed 2014·Granted Sep 1, 2015·1 cites·18 claims
- 1260US11527499B2Integrated fan-out structures and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 13, 2022·0 cites·20 claims
- 1360US9018772B2Chip structure and multi-chip stack packageCHIPMOS TECHNOLOGIES INC·Filed 2013·Granted Apr 28, 2015·1 cites·15 claims
- 1452US8980695B2Manufacturing method of wafer level packageCHIPMOS TECHNOLOGIES INC·Filed 2014·Granted Mar 17, 2015·0 cites·14 claims
- 1546US9576820B2Semiconductor structure and method of manufacturing the sameCHIPMOS TECHNOLOGIES INC·Filed 2013·Granted Feb 21, 2017·0 cites·13 claims
- 1646US9190324B2Manufacturing method for micro bump structureCHIPMOS TECHNOLOGIES INC·Filed 2013·Granted Nov 17, 2015·0 cites·28 claims
- 1743US2015130084A1Package structure and method for manufacturing the sameCHIPMOS TECHNOLOGIES INC·Filed 2014·Application pending·0 cites
- 1843US2015053752A1Ball planting device and ball planting method thereofCHIPMOS TECHNOLOGIES INC·Filed 2014·Application pending·0 cites
- 1943US2015123252A1Lead frame package and manufacturing method thereofCHIPMOS TECHNOLOGIES INC·Filed 2014·Application pending·0 cites
- 2041US10879098B2Semiconductor chip holderTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 29, 2020·0 cites·18 claims
- 2141US2014061880A1Wafer level chip scale packageCHIPMOS TECHNOLOGIES INC·Filed 2013·Application pending·0 cites
- 2241US2014061906A1Semiconductor structureCHIPMOS TECHNOLOGIES INC·Filed 2013·Application pending·0 cites
- 2331US9196553B2Semiconductor package structure and manufacturing method thereofLIAO TSUNG-JEN·Filed 2012·Granted Nov 24, 2015·0 cites·14 claims
- 2430US2013049198A1Semiconductor package structure and manufacturing method thereofLIAO TSUNG-JEN·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →