Inventor · disambiguated record
Tsang-Jung Lin
Also filed as: LIN TSANG-JUNG
5 granted patents·7 pending applications·108 citations·filing 1997–2007
82Inventor score
Top patents by PatentIndex Score
12 records- 0177US6077147AChemical-mechanical polishing station with end-point monitoring deviceUNITED MICROELECTRONICS CORP·Filed 1999·Granted Jun 20, 2000·42 cites·10 claims
- 0264US6132078ASlurry providing systemUNITED INTEGRATED CIRCUITS CORP·Filed 1998·Granted Oct 17, 2000·28 cites·16 claims
- 0362US6100205AIntermetal dielectric layer formation with low dielectric constant using high density plasma chemical vapor deposition processUNITED MICROELECTRONICS CORP·Filed 1997·Granted Aug 8, 2000·27 cites·35 claims
- 0439US2003056727A1Method of depositing thin films and apparatus for depositing the sameFiled 2002·Application pending·0 cites
- 0538US2007145538A1Cmp apparatus for polishing dielectric layer and method of controlling dielectric layer thicknessLIN TSANG-JUNG·Filed 2005·Application pending·0 cites
- 0636US2008254619A1Method of fabricating a semiconductor deviceLIN TSANG-JUNG·Filed 2007·Application pending·0 cites
- 0734US2004101385A1Semiconductor process apparatus and SMIF pod used thereinFiled 2002·Application pending·0 cites
- 0833US6218320B1Method for improving the uniformity of wafer-to-wafer film thicknessUNITED MICROELECTRONICS CORP·Filed 1998·Granted Apr 17, 2001·8 cites·8 claims
- 0931US2003114076A1Apparatus for chemical mechanical polishingFiled 2001·Application pending·0 cites
- 1030US6211060B1Method for planarizing a damascene structureUNITED MICROELECTRONICS CORP·Filed 1998·Granted Apr 3, 2001·3 cites·7 claims
- 1129US2003134581A1Device for chemical mechanical polishingFiled 2002·Application pending·0 cites
- 1225US2001050142A1Chemical-mechanical polishing apparatus with megasonic energy slurry supply systemFiled 1999·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →