Inventor · disambiguated record
Tsugunori Masuda
Also filed as: MASUDA TSUGUNORI
8 granted patents·1 pending application·110 citations·filing 1984–2004
88Inventor score
Top patents by PatentIndex Score
9 records- 0182US6742701B2Bump forming method, presoldering treatment method, soldering method, bump forming apparatus, presoldering treatment device and soldering apparatusTAMURA SEISAKUSHO KK·Filed 2002·Granted Jun 1, 2004·26 cites·31 claims
- 0273US6364195B1Brazing ApparatusTAMURA SEISAKUSHO KK·Filed 2000·Granted Apr 2, 2002·18 cites·13 claims
- 0360US4787550AAutomatic soldering apparatusTAMURA SEISAKUSHO KK·Filed 1987·Granted Nov 29, 1988·17 cites·3 claims
- 0456US4846390AAutomatic soldering apparatusTAMURA SEISAKUSHO KK·Filed 1988·Granted Jul 11, 1989·15 cites·6 claims
- 0547US6050473ABrazing apparatusTAMURA SEISA KUSHO KK·Filed 1997·Granted Apr 18, 2000·14 cites·15 claims
- 0643US5981922ABrazing apparatus having electromagnetic induction pumps for moving a brazing filler metal in contact with a workpieceTAMURA SEISAKUSHO KK·Filed 1997·Granted Nov 9, 1999·10 cites·9 claims
- 0740US2004238602A1Bump forming method, presoldering treatment method, soldering method, bump forming apparatus, presoldering treatment device and soldering apparatusTAMURA SEISAKUSHO KK·Filed 2004·Application pending·0 cites
- 0835US4603804AAutomatic soldering apparatusTAMURA SEISAKUSHO KK·Filed 1984·Granted Aug 5, 1986·5 cites·6 claims
- 0927US4682563AJig for supporting array of articles to be soldered and device for transferring articles to jigTAMURA SEISAKUSHO KK·Filed 1985·Granted Jul 28, 1987·5 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →