Inventor · disambiguated record
Tsubasa Miki
Also filed as: MIKI TSUBASA
1 granted patent·10 pending applications·6 citations·filing 2007–2025
28Inventor score
Top patents by PatentIndex Score
11 records- 0172US7611926B2Thermosetting die bonding filmNITTO DENKO CORP·Filed 2008·Granted Nov 3, 2009·6 cites·15 claims
- 0255US2011151252A1Adhesive tape or sheetNITTO DENKO CORP·Filed 2009·Application pending·0 cites
- 0350US2025248279A1Transparent laminate, image display device, and flexible deviceDAICEL CORP·Filed 2025·Application pending·0 cites
- 0448US2025243378A1Surface layer protection film for inorganic materials, etching method, and method for producing inorganic material that has etched surface layerDAICEL CORP·Filed 2023·Application pending·0 cites
- 0547US2025243110A1Curable composition, undercoat layer, laminate, and display deviceDAICEL CORP·Filed 2025·Application pending·0 cites
- 0641US2008057253A1Adhesive sheet for water jet laser dicingNITTO DENKO CORP·Filed 2007·Application pending·0 cites
- 0741US2008057270A1Adhesive sheet for water jet laser dicingNITTO DENKO CORP·Filed 2007·Application pending·0 cites
- 0841US2008182095A1Adhesive sheet for water jet laser dicingNITTO DENKO CORP·Filed 2007·Application pending·0 cites
- 0941US2008108262A1Adhesive sheet for water jet laser dicingNITTO DENKO CORP·Filed 2007·Application pending·0 cites
- 1039US2010219507A1Process for producing semiconductor deviceMISUMI SADAHITO·Filed 2007·Application pending·0 cites
- 1137US2009311474A1Adhesive sheet for water jet laser dicingTAKAHASHI TOMOKAZU·Filed 2008·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →