Inventor · disambiguated record
Tsuyoshi Mutou
Also filed as: MUTOU TSUYOSHI
10 granted patents·2 pending applications·15 citations·filing 2013–2018
81Inventor score
Top patents by PatentIndex Score
12 records- 0192US9431593B2Thermoelectric conversion material and production method thereforLINTEC CORP·Filed 2014·Granted Aug 30, 2016·11 cites·18 claims
- 0279US9944831B2Heat-conductive adhesive sheet, manufacturing method for same, and electronic device using sameLINTEC CORP·Filed 2014·Granted Apr 17, 2018·2 cites·20 claims
- 0371US10490724B2Peltier cooling element and method for manufacturing sameLINTEC CORP·Filed 2015·Granted Nov 26, 2019·1 cites·12 claims
- 0464US9461228B2Thermoelectric conversion material and method for manufacturing sameLINTEC CORP·Filed 2013·Granted Oct 4, 2016·1 cites·20 claims
- 0558US11522114B2Thermoelectric conversion material and method for producing sameLINTEC CORP·Filed 2017·Granted Dec 6, 2022·0 cites·7 claims
- 0656US10122045B2Solid electrolyte membrane with film and method for producing sameLINTEC CORP·Filed 2015·Granted Nov 6, 2018·0 cites·4 claims
- 0752US2016222256A1Heat-conductive adhesive sheet, manufacturing method for same, and electronic device using sameLINTEC CORP·Filed 2014·Application pending·0 cites
- 0843US9608190B2Thermoelectric conversion material, method for producing same, and thermoelectric conversion moduleLINTEC CORP·Filed 2014·Granted Mar 28, 2017·0 cites·10 claims
- 0942US2019378967A1Flexible thermoelectric conversion element and method for manufacturing sameLINTEC CORP·Filed 2018·Application pending·0 cites
- 1038US10403807B2Thermoelectric conversion material and method for manufacturing sameLINTEC CORP·Filed 2013·Granted Sep 3, 2019·0 cites·3 claims
- 1135US9780283B2Thermoelectric conversion elementNAT UNIV CORP NAGAOKA UNIV OF TECH·Filed 2014·Granted Oct 3, 2017·0 cites·9 claims
- 1235US9620697B2Thermoelectric conversion materialKYUSHU INST TECHNOLOGY·Filed 2013·Granted Apr 11, 2017·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →