Inventor · disambiguated record
Tsubasa Obata
Also filed as: OBATA TSUBASA
13 granted patents·1 pending application·15 citations·filing 2015–2022
84Inventor score
Files withDISCO CORP14
Top patents by PatentIndex Score
14 records- 0187US9293372B2Wafer processing methodDISCO CORP·Filed 2015·Granted Mar 22, 2016·7 cites·2 claims
- 0278US9536787B2Wafer processing methodDISCO CORP·Filed 2016·Granted Jan 3, 2017·3 cites·3 claims
- 0376US10840140B2Backside wafer dividing method using water-soluble protective filmDISCO CORP·Filed 2019·Granted Nov 17, 2020·2 cites·4 claims
- 0476US10049934B2Wafer processing methodDISCO CORP·Filed 2017·Granted Aug 14, 2018·2 cites·1 claims
- 0563US9716039B2Wafer processing methodDISCO CORP·Filed 2016·Granted Jul 25, 2017·1 cites·2 claims
- 0656US12296407B2Laser processing apparatusDISCO CORP·Filed 2022·Granted May 13, 2025·0 cites·3 claims
- 0755US2021170524A1Laser beam adjustment system and laser processing apparatusDISCO CORP·Filed 2020·Application pending·0 cites
- 0841US9455149B2Plate-like object processing methodDISCO CORP·Filed 2015·Granted Sep 27, 2016·0 cites·15 claims
- 0940US10985065B2Method of dicing a wafer by pre-sawing and subsequent laser cuttingDISCO CORP·Filed 2017·Granted Apr 20, 2021·0 cites·2 claims
- 1040US9698301B2Wafer processing methodDISCO CORP·Filed 2016·Granted Jul 4, 2017·0 cites·3 claims
- 1139US10861712B2Workpiece processing methodDISCO CORP·Filed 2018·Granted Dec 8, 2020·0 cites·9 claims
- 1237US10796926B2Method of manufacturing glass interposerDISCO CORP·Filed 2018·Granted Oct 6, 2020·0 cites·2 claims
- 1337US9953871B2Wafer processing methodDISCO CORP·Filed 2016·Granted Apr 24, 2018·0 cites·15 claims
- 1432US9779993B2Wafer processing method including attaching a protective tape to a front side of a functional layer to prevent debris adhesionDISCO CORP·Filed 2015·Granted Oct 3, 2017·0 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →