Inventor · disambiguated record
Tsuyoshi Takeda
Also filed as: TAKEDA TSUYOSHI
68 granted patents·22 pending applications·142 citations·filing 1999–2025
98Inventor score
Files withKOKUSAI ELECTRIC CORP32HITACHI INT ELECTRIC INC22PANASONIC CORP9SAGINOMIYA SEISAKUSHO INC5TEIJIN LTD5
Top patents by PatentIndex Score
90 records- 0199US11629408B2Plasma generation device, substrate processing apparatus, and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2020·Granted Apr 18, 2023·8 cites·14 claims
- 0298US11469083B2Plasma generating device, substrate processing apparatus, and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2021·Granted Oct 11, 2022·4 cites·17 claims
- 0397US11967490B2Plasma generating device, substrate processing apparatus, and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2022·Granted Apr 23, 2024·2 cites·17 claims
- 0496US12094735B2Substrate processing apparatus, plurality of electrodes and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2022·Granted Sep 17, 2024·2 cites·19 claims
- 0595US11749510B2Plasma generating device, substrate processing apparatus, and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2021·Granted Sep 5, 2023·2 cites·19 claims
- 0693US8846546B2Method of manufacturing semiconductor device, substrate processing method, substrate processing apparatus and recording mediumHITACHI INT ELECTRIC INC·Filed 2012·Granted Sep 30, 2014·14 cites·17 claims
- 0791US11469081B2Plasma generating device, substrate processing apparatus, and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2019·Granted Oct 11, 2022·4 cites·14 claims
- 0890US11804365B2Substrate processing apparatus, plasma generating apparatus, and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2022·Granted Oct 31, 2023·1 cites·18 claims
- 0988US8929092B2Circuit board, and semiconductor device having component mounted on circuit boardYOSHIOKA SHINGO·Filed 2010·Granted Jan 6, 2015·10 cites·5 claims
- 1086US2024249923A1Plasma generating device, substrate processing apparatus, and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 1185US12068136B2Substrate processing apparatus, method of manufacturing semiconductor device, and plasma generatorKOKUSAI ELECTRIC CORP·Filed 2021·Granted Aug 20, 2024·1 cites·11 claims
- 1285US9070393B2Three-dimensional structure in which wiring is provided on its surfacePANASONIC CORP·Filed 2014·Granted Jun 30, 2015·6 cites·2 claims
- 1383US10679831B2Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2017·Granted Jun 9, 2020·1 cites·9 claims
- 1483US9607908B1Method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2016·Granted Mar 28, 2017·3 cites·15 claims
- 1582US9698050B1Method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2016·Granted Jul 4, 2017·3 cites·20 claims
- 1682US9090969B2Semiconductor device manufacturing and processing methods and apparatuses for forming a filmTAKEDA TSUYOSHI·Filed 2012·Granted Jul 28, 2015·5 cites·16 claims
- 1782US8951912B2Method of manufacturing semiconductor device, method of processing substrate, substrate processing apparatus and computer-readable recording mediumOGAWA ARITO·Filed 2012·Granted Feb 10, 2015·4 cites·16 claims
- 1880US2024412987A1Substrate processing apparatus, plurality of electrodes and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 1979US12492476B2Substrate processing apparatus, method of processing substrate, method of manufacturing semiconductor device, and plasma generation device preliminaryKOKUSAI ELECTRIC CORP·Filed 2023·Granted Dec 9, 2025·0 cites·16 claims
- 2079US9351402B2Circuit board, and semiconductor device having component mounted on circuit boardPANASONIC CORP·Filed 2014·Granted May 24, 2016·4 cites·2 claims
- 2179US9184046B2Semiconductor device manufacturing and processing methods and apparatuses for forming a filmHITACHI INT ELECTRIC INC·Filed 2015·Granted Nov 10, 2015·2 cites·14 claims
- 2277US11380563B2Substrate processing apparatus, plurality of electrodes and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2019·Granted Jul 5, 2022·1 cites·16 claims
- 2377US10153132B2Substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2017·Granted Dec 11, 2018·2 cites·17 claims
- 2477US9337015B2Method of manufacturing a semiconductor device, method of processing a substrate, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2013·Granted May 10, 2016·5 cites·15 claims
- 2576US9012323B2Method of manufacturing semiconductor device, method of processing substrate, substrate processing apparatus and computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2014·Granted Apr 21, 2015·2 cites·15 claims
- 2675US9018340B2Copolycarbonate and transparent molded article obtained therefromTAKEDA TSUYOSHI·Filed 2012·Granted Apr 28, 2015·2 cites·11 claims
- 2774US9082438B2Three-dimensional structure for wiring formationPANASONIC CORP·Filed 2014·Granted Jul 14, 2015·2 cites·1 claims
- 2873US9745656B2Method of manufacturing semiconductor device, method of processing substrate, substrate processing apparatus and computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2016·Granted Aug 29, 2017·1 cites·21 claims
- 2973US2024055237A1Substrate processing apparatus, plasma generating apparatus, and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 3073US2025154654A1Substrate processing apparatus, method of processing substrate, method of manufacturing semiconductor device, and plasma generation deviceKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 3170US9406520B2Method of manufacturing semiconductor device, method of processing substrate, substrate processing apparatus and computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2015·Granted Aug 2, 2016·1 cites·11 claims
- 3270US9378964B2Method of manufacturing semiconductor device, method of processing substrate, substrate processing apparatus and computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2015·Granted Jun 28, 2016·1 cites·13 claims
- 3370US9355850B2Method of manufacturing semiconductor device, method of processing substrate, substrate processing apparatus and computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2015·Granted May 31, 2016·1 cites·14 claims
- 3469US10796934B2Substrate processing apparatus, method of manufacturing semiconductor device and electrode fixing partKOKUSAI ELECTRIC CORP·Filed 2019·Granted Oct 6, 2020·1 cites·16 claims
- 3568US10128128B2Method of manufacturing semiconductor device having air gap between wirings for low dielectric constantHITACHI INT ELECTRIC INC·Filed 2017·Granted Nov 13, 2018·1 cites·5 claims
- 3668US2025170803A1Laminate and electronic device using the samePANASONIC IP MAN CO LTD·Filed 2024·Application pending·0 cites
- 3766US12400840B2Substrate processing apparatus, substrate holder, and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2023·Granted Aug 26, 2025·0 cites·18 claims
- 3863US12488962B2Substrate processing apparatus, plasma generating apparatus, and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2022·Granted Dec 2, 2025·0 cites·19 claims
- 3963US12463017B2Substrate processing apparatus, plasma light emitting apparatus and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2023·Granted Nov 4, 2025·0 cites·14 claims
- 4063USD765146SPump body for centrifugal pump unitKk saginomiya seisakusho·Filed 2015·Granted Aug 30, 2016·11 cites·1 claims
- 4162US11961715B2Substrate processing apparatus, substrate retainer and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2021·Granted Apr 16, 2024·0 cites·12 claims
- 4262US2024363309A1Substrate processing apparatus, semiconductor device manufacturing method, and substrate processing methodKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 4361US9082635B2Wiring method, structure having wiring provided on surface, semiconductor device, wiring board, memory card, electric device, module and multilayer circuit boardYOSHIOKA SHINGO·Filed 2011·Granted Jul 14, 2015·1 cites·9 claims
- 4461US2024222087A1Substrate processing apparatus, plasma generating apparatus, substrate processing method, method of manufacturing semiconductor device and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 4561US2024312764A1Matcher, substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 4660US9175151B2Resin composition and method for producing circuit boardPANASONIC CORP·Filed 2014·Granted Nov 3, 2015·0 cites·1 claims
- 4760US9082825B2Manufacturing method for semiconductor package, semiconductor package, and semiconductor devicePANASONIC CORP·Filed 2012·Granted Jul 14, 2015·1 cites·19 claims
- 4859US2024006164A1Electrode structure, substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 4958US10138355B2Flame-retardant resin composition and molded article produced from sameTEIJIN LTD·Filed 2016·Granted Nov 27, 2018·0 cites·5 claims
- 5058USD765145SCentrifugal pump unitKk saginomiya seisakusho·Filed 2015·Granted Aug 30, 2016·9 cites·1 claims
Showing the top 50 of 90 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →