Inventor · disambiguated record
Tsung-Shang Wei
Also filed as: WEI TSUNG-SHANG
2 granted patents·3 pending applications·7 citations·filing 2014–2024
52Inventor score
Technology areasH10W
Top patents by PatentIndex Score
5 records- 0191US10510561B2Semiconductor device package including conformal metal cap contacting each semiconductor dieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 17, 2019·7 cites·20 claims
- 0266US2021090906A1Semiconductor Device and MethodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Application pending·0 cites
- 0362US11488842B2Method of making semiconductor device package including conformal metal cap contacting each semiconductor dieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 1, 2022·0 cites·20 claims
- 0454US2015287697A1Semiconductor Device and MethodTAIWAN SEMICONDUCTOR MFG·Filed 2014·Application pending·0 cites
- 0552US2025364266A1Integrated wet passivation on cmp for hybrid bonding post-cu pad polish cappingAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →