Inventor · disambiguated record
Tsung-Lieh Weng
Also filed as: WENG TSUNG-LIEH
0 granted patents·4 pending applications·0 citations·filing 2013–2020
Files withITEQ CORP4
Top patents by PatentIndex Score
4 records- 0137US2015148453A1Halogen-free epoxy resin composition for integrated circuit packagingITEQ CORP·Filed 2013·Application pending·0 cites
- 0237US2015147799A1Halogen-free high-frequency resin compositionITEQ CORP·Filed 2013·Application pending·0 cites
- 0337US2015148450A1Halogen-free low-expansion resin compositionITEQ CORP·Filed 2013·Application pending·0 cites
- 0435US2021147646A1Prepreg, laminated and printed circuit board thereofITEQ CORP·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →