Inventor · disambiguated record
Tsunyen Wu
Also filed as: WU TSUNYEN
0 granted patents·14 pending applications·0 citations·filing 2023–2025
Technology areasH10W
Files withTAIWAN SEMICONDUCTOR MFG CO LTD14
Top patents by PatentIndex Score
14 records- 0177US2025357268A1Semiconductor Device Package with Thermal ModuleTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0276US2025357269A1Multizone thermal device for semiconductor structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0375US2025349795A1Metallic lid structure for dissipating heat generated by a thermal hot spot region of an ic structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0472US2025336755A1Semiconductor package with double-sided thermal solution and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0571US2025246516A1Multizone thermal device for semiconductor structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0671US2025323122A1Package structure with heat dissipation structure having one or more vapor chambers over ic chipsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0769US2025233047A1Package structure with heat dissipation structure having one or more vapor chambers over ic chipsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0868US2024395770A1Metallic lid structure for dissipating heat generated by a thermal hot spot region of an ic structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 0968US2024395663A1Semiconductor Device Package with Thermal ModuleTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1068US2025201651A1Semiconductor package with double-sided thermal solution and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1159US2025246517A1Multi-zone impingement cooling of semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1257US2025343096A1Semiconductor device packages and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1356US2025112137A1Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1456US2025096071A1Integrated circuit cooling systems and methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →