Inventor · disambiguated record

Tsung-Kai Yu

Also filed as: YU TSUNG-KAI

1 granted patent·1 pending application·0 citations·filing 2020–2023

6Inventor score

Technology areasH10W

Files withUNITED MICROELECTRONICS CORP2

Top patents by PatentIndex Score

2 records

0159US2024413136A1Three-dimensional integrated circuit structureUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
0244US11495510B2Semiconductor device package structure and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2020·Granted Nov 8, 2022·0 cites·18 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →