Inventor · disambiguated record
Tuck Foong Koh
Also filed as: KOH TUCK FOONG
13 granted patents·8 pending applications·5 citations·filing 2015–2023
83Inventor score
Files withAPPLIED MATERIALS INC21
Top patents by PatentIndex Score
21 records- 0181US10991617B2Methods and apparatus for cleaving of semiconductor substratesAPPLIED MATERIALS INC·Filed 2019·Granted Apr 27, 2021·2 cites·4 claims
- 0280US11328929B2Methods, apparatuses and systems for substrate processing for lowering contact resistanceAPPLIED MATERIALS INC·Filed 2019·Granted May 10, 2022·2 cites·13 claims
- 0370US11610807B2Methods and apparatus for cleaving of semiconductor substratesAPPLIED MATERIALS INC·Filed 2021·Granted Mar 21, 2023·0 cites·19 claims
- 0470US11569122B2Methods and apparatus for cleaving of semiconductor substratesAPPLIED MATERIALS INC·Filed 2021·Granted Jan 31, 2023·0 cites·20 claims
- 0565US9818624B2Methods and apparatus for correcting substrate deformityAPPLIED MATERIALS INC·Filed 2016·Granted Nov 14, 2017·1 cites·20 claims
- 0664US11670513B2Apparatus and systems for substrate processing for lowering contact resistanceAPPLIED MATERIALS INC·Filed 2021·Granted Jun 6, 2023·0 cites·18 claims
- 0760US12476086B2Spray-coated electrostatic chuck designAPPLIED MATERIALS INC·Filed 2023·Granted Nov 18, 2025·0 cites·15 claims
- 0860US12438005B2Low temperature selective etching of silicon nitride using microwave plasmaAPPLIED MATERIALS INC·Filed 2022·Granted Oct 7, 2025·0 cites·19 claims
- 0959US12315739B2Isotropic silicon nitride removalAPPLIED MATERIALS INC·Filed 2022·Granted May 27, 2025·0 cites·20 claims
- 1057US2024420962A1Methods of selectively etching silicon nitrideAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1157US2025069894A1Methods of selectively etching silicon nitrideAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1254US12057299B2Methods for selective removal of contact oxidesAPPLIED MATERIALS INC·Filed 2021·Granted Aug 6, 2024·0 cites·20 claims
- 1354US2024395514A1Multi-chamber processing tool with enhanced throughputAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1451US2023343615A1In-situ low temperature measurement of low emissivity substratesAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 1550US11629409B2Inline microwave batch degas chamberAPPLIED MATERIALS INC·Filed 2019·Granted Apr 18, 2023·0 cites·20 claims
- 1650US11375584B2Methods and apparatus for processing a substrate using microwave energyAPPLIED MATERIALS INC·Filed 2019·Granted Jun 28, 2022·0 cites·20 claims
- 1748US2022406643A1Semitransparent substrate support for microwave degas chamberAPPLIED MATERIALS INC·Filed 2021·Application pending·0 cites
- 1842US2021001520A1Methods and apparatus for microwave processing of polymer materialsAPPLIED MATERIALS INC·Filed 2020·Application pending·0 cites
- 1939US10978334B2Sealing structure for workpiece to substrate bonding in a processing chamberAPPLIED MATERIALS INC·Filed 2015·Granted Apr 13, 2021·0 cites·18 claims
- 2038US2019385874A1Methods and apparatus for reconfigurable flow control in process chambersAPPLIED MATERIALS INC·Filed 2018·Application pending·0 cites
- 2137US2017365490A1Methods for polymer coefficient of thermal expansion (cte) tuning by microwave curingAPPLIED MATERIALS INC·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →