Inventor · disambiguated record
Tung-Ching Tseng
Also filed as: TSENG TUNG-CHING
14 granted patents·2 pending applications·124 citations·filing 1999–2022
90Inventor score
Top patents by PatentIndex Score
16 records- 0189US6579151B2Retaining ring with active edge-profile control by piezoelectric actuator/sensorsTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Jun 17, 2003·38 cites·14 claims
- 0285US6176930B1Apparatus and method for controlling a flow of process material to a deposition chamberAPPLIED MATERIALS INC·Filed 1999·Granted Jan 23, 2001·62 cites·18 claims
- 0380US9318364B2Semiconductor device metallization systems and methodsTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Apr 19, 2016·3 cites·20 claims
- 0473US2023098570A1Gachemical vapor deposition apparatus with cleaning gas flow guiding memberTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 0571US10121698B2Method of manufacturing a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Nov 6, 2018·1 cites·20 claims
- 0660US6686284B2Chemical mechanical polisher equipped with chilled retaining ring and method of usingTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Feb 3, 2004·8 cites·17 claims
- 0757US11532459B2Chemical vapor deposition apparatus with cleaning gas flow guiding memberTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 20, 2022·0 cites·20 claims
- 0857US9548241B2Semiconductor device metallization systems and methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 17, 2017·0 cites·20 claims
- 0956US6812069B2Method for improving semiconductor process wafer CMP uniformity while avoiding fractureTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Nov 2, 2004·5 cites·19 claims
- 1046US6930040B2Method of forming a contact on a silicon-on-insulator waferTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Aug 16, 2005·2 cites·26 claims
- 1144US6579150B2Dual detection method for end point in chemical mechanical polishingTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Jun 17, 2003·2 cites·13 claims
- 1243US7109117B2Method for chemical mechanical polishing of a shallow trench isolation structureTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Sep 19, 2006·2 cites·8 claims
- 1342US11315810B2Apparatus for wafer processingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 26, 2022·0 cites·17 claims
- 1440US7297632B2Scratch reduction for chemical mechanical polishingTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Nov 20, 2007·0 cites·21 claims
- 1535US7016790B2In-line hot-wire sensor for slurry monitoringTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Mar 21, 2006·1 cites·5 claims
- 1633US2017194162A1Semiconductor manufacturing equipment and method for treating waferTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →