Inventor · disambiguated record
Twila J. Reeves
Also filed as: REEVES TWILA J
3 granted patents·636 citations·filing 1993–1997
80Inventor score
Technology areasH10W
Files withMOTOROLA INC3
Top patents by PatentIndex Score
3 records- 0195US5474958AMethod for making semiconductor device having no die supporting surfaceMOTOROLA INC·Filed 1993·Granted Dec 12, 1995·483 cites·14 claims
- 0284USRE36773EMethod for plating using nested plating buses and semiconductor device having the sameMOTOROLA INC·Filed 1997·Granted Jul 11, 2000·76 cites·21 claims
- 0384US5467252AMethod for plating using nested plating buses and semiconductor device having the sameMOTOROLA INC·Filed 1993·Granted Nov 14, 1995·77 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →