Inventor · disambiguated record
Tzu-Wei Chiu
Also filed as: CHIU TZU-WEI
24 granted patents·11 pending applications·1,013 citations·filing 2010–2025
95Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD11SERIPHY TECH CORPORATION9CHIU TZU WEI5TAIWAN SEMICONDUCTOR MFG4NEXTHIN TECH3
Top patents by PatentIndex Score
35 records- 0198US9299649B23D packages and methods for forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Mar 29, 2016·902 cites·22 claims
- 0296US11069539B23D packages and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 20, 2021·3 cites·20 claims
- 0396US8283781B2Semiconductor device having pad structure with stress buffer layerWU WEI-CHENG·Filed 2010·Granted Oct 9, 2012·33 cites·20 claims
- 0494US8558229B2Passivation layer for packaged chipJENG SHIN-PUU·Filed 2011·Granted Oct 15, 2013·19 cites·20 claims
- 0593US10269584B23D packages and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 23, 2019·7 cites·19 claims
- 0691US10056347B2Bump structure for yield improvementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 21, 2018·3 cites·21 claims
- 0791US9570366B2Passivation layer for packaged chipTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Feb 14, 2017·11 cites·20 claims
- 0889US8354750B2Stress buffer structures in a mounting structure of a semiconductor deviceTAIWAN SEMICONDUCTOR MFG·Filed 2010·Granted Jan 15, 2013·9 cites·16 claims
- 0988US10665474B23D packages and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 26, 2020·3 cites·20 claims
- 1086US11107758B2Fan-out package structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 31, 2021·2 cites·20 claims
- 1185US9337118B2Stress buffer structures in a mounting structure of a semiconductor deviceTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted May 10, 2016·5 cites·12 claims
- 1284US10163770B2Fan-out package structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 25, 2018·2 cites·20 claims
- 1384US8906798B2Methods of manufacturing stress buffer structures in a mounting structure of a semiconductor deviceTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Dec 9, 2014·5 cites·20 claims
- 1482US2025372444A1Method for manufacturing semiconductor stack structure with ultra thin dieNEXTHIN TECH·Filed 2025·Application pending·0 cites
- 1578US8587089B2Seal ring structure with polyimide layer adhesionCHIU TZU-WEI·Filed 2010·Granted Nov 19, 2013·6 cites·20 claims
- 1677US12374581B2Method for manufacturing semiconductor stack structure with ultra thin dieNEXTHIN TECH·Filed 2024·Granted Jul 29, 2025·0 cites·25 claims
- 1776US11715681B2Fan-out package structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 1, 2023·0 cites·20 claims
- 1875US11830745B23D packages and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 28, 2023·0 cites·19 claims
- 1975US2025132229A1Method for manufacturing semiconductor structure with power connecting structures under transistorsCHIU TZU WEI·Filed 2024·Application pending·0 cites
- 2067US12224227B2Method for manufacturing semiconductor structure with power connecting structures under transistors and semiconductor structure with power connecting structures under transistorsCHIU TZU WEI·Filed 2022·Granted Feb 11, 2025·0 cites·2 claims
- 2164US12412776B2Method for manufacturing semiconductor stack structure with ultra thin dieNEXTHIN TECH·Filed 2021·Granted Sep 9, 2025·0 cites·15 claims
- 2264US10510648B2Fan-out package structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·0 cites·20 claims
- 2364US8896089B2Interposers for semiconductor devices and methods of manufacture thereofCHIU TZU-WEI·Filed 2011·Granted Nov 25, 2014·2 cites·20 claims
- 2461US9553053B2Bump structure for yield improvementCHIU TZU-WEI·Filed 2012·Granted Jan 24, 2017·1 cites·21 claims
- 2558US9953911B2Fan-out package structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 24, 2018·0 cites·20 claims
- 2658US2024174892A1Polishing compositions and methods of use thereofFUJIFILM ELECTRONIC MAT USA INC·Filed 2023·Application pending·0 cites
- 2754US2024413069A1Semiconductor structures and method for manufacturing a semiconductor structureSERIPHY TECH CORPORATION·Filed 2024·Application pending·0 cites
- 2851US2024203941A1Semiconductor package and method for manufacturing a semiconductor packageSERIPHY TECH CORPORATION·Filed 2023·Application pending·0 cites
- 2951US2024203925A1Semiconductor package and method for manufacturing a semiconductor packageSERIPHY TECH CORPORATION·Filed 2023·Application pending·0 cites
- 3050US12374674B2Semiconductor structure and semiconductor deviceSERIPHY TECH CORPORATION·Filed 2022·Granted Jul 29, 2025·0 cites·24 claims
- 3150US2024312891A1Semiconductor structure and method for manufacturing a semiconductor structureSERIPHY TECH CORPORATION·Filed 2023·Application pending·0 cites
- 3249US2024312874A1Semiconductor structures and method for manufacturing a semiconductor structureSERIPHY TECH CORPORATION·Filed 2023·Application pending·0 cites
- 3349US2024243068A1Semiconductor packages, semiconductor device and method for manufacturing a semiconductor packageSERIPHY TECH CORPORATION·Filed 2023·Application pending·0 cites
- 3448US2024203848A1Semiconductor structures and method for manufacturing a semiconductor structureSERIPHY TECH CORPORATION·Filed 2023·Application pending·0 cites
- 3548US2024120282A1Semiconductor structures and method for manufacturing a semiconductor structureSERIPHY TECH CORPORATION·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →