Inventor · disambiguated record
Tzong-Che Ho
Also filed as: HO TZONG-CHE
17 granted patents·5 pending applications·281 citations·filing 2004–2014
93Inventor score
Top patents by PatentIndex Score
22 records- 0196US7314291B2LED lampIND TECH RES INST·Filed 2004·Granted Jan 1, 2008·145 cites·21 claims
- 0293US7969016B2Self-aligned wafer or chip structure, and self-aligned stacked structureIND TECH RES INST·Filed 2007·Granted Jun 28, 2011·34 cites·15 claims
- 0392US7413326B2LED lampIND TECH RES INST·Filed 2007·Granted Aug 19, 2008·58 cites·18 claims
- 0487US9236275B2MEMS acoustic transducer and method for fabricating the sameIND TECH RES INST·Filed 2012·Granted Jan 12, 2016·10 cites·14 claims
- 0584US9369788B1MEMS microphone packageIND TECH RES INST·Filed 2014·Granted Jun 14, 2016·8 cites·39 claims
- 0683US8693711B2Capacitive transducer and fabrication methodHO TZONG-CHE·Filed 2009·Granted Apr 8, 2014·15 cites·15 claims
- 0766US7973454B1Vacuum hermetic organic packaging carrier and sensor device packageIND TECH RES INST·Filed 2010·Granted Jul 5, 2011·2 cites·13 claims
- 0865US8763457B2Sensing device and manufacturing method thereofCHEN LUNG-TAI·Filed 2011·Granted Jul 1, 2014·2 cites·19 claims
- 0964US9343651B2Organic packaging carrierCHEN LUNG-TAI·Filed 2012·Granted May 17, 2016·2 cites·7 claims
- 1063US7915065B2Wafer level sensing package and manufacturing process thereofIND TECH RES INST·Filed 2008·Granted Mar 29, 2011·2 cites·10 claims
- 1160US8421216B2Vacuum hermetic organic packaging carrierCHEN LUNG-TAI·Filed 2011·Granted Apr 16, 2013·1 cites·12 claims
- 1258US7119429B23-D stackable semiconductor packageIND TECH RES INST·Filed 2005·Granted Oct 10, 2006·1 cites·10 claims
- 1352USRE43626ELED lampTAIN RA-MIN·Filed 2010·Granted Sep 4, 2012·0 cites·22 claims
- 1451US7375384B2Side structure of a bare LED and backlight module thereofIND TECH RES INST·Filed 2007·Granted May 20, 2008·0 cites·4 claims
- 1550US2008278337A1Urine detection system and methodIND TECH RES INST·Filed 2007·Application pending·0 cites
- 1649US9133018B2Structure and fabrication method of a sensing deviceCHEN LUNG-TAI·Filed 2009·Granted Sep 15, 2015·0 cites·14 claims
- 1749US2009121299A1Wafer level sensing package and manufacturing process thereofIND TECH RES INST·Filed 2008·Application pending·0 cites
- 1848US2008284860A1Image stabilization driving deviceIND TECH RES INST·Filed 2007·Application pending·0 cites
- 1946US7312478B2Side structure of a bare LED and backlight module thereofIND TECH RES INST·Filed 2004·Granted Dec 25, 2007·1 cites·15 claims
- 2042US2008074274A1DiaperIND TECH RES INST·Filed 2007·Application pending·0 cites
- 2139US8508022B2Ultra thin package for electric acoustic sensor chip of micro electro mechanical systemHO TZONG-CHE·Filed 2008·Granted Aug 13, 2013·0 cites·18 claims
- 2236US2012146163A1Microphone package structure and method for fabricating the sameHO TZONG-CHE·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →