Inventor · disambiguated record
Tzu-Hsuan Wang
Also filed as: WANG TZU-HSUAN
12 granted patents·1 pending application·6 citations·filing 2018–2022
82Inventor score
Top patents by PatentIndex Score
13 records- 0188US11430768B2Stacked die chip package structure and method of manufacturing the sameUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Aug 30, 2022·2 cites·19 claims
- 0281US11302601B1IGBT module with heat dissipation structure and method for manufacturing the sameAMULAIRE THERMAL TECH INC·Filed 2020·Granted Apr 12, 2022·1 cites·4 claims
- 0375US11037857B1IGBT module with heat dissipation structure having copper layers of different thicknessesAMULAIRE THERMAL TECH INC·Filed 2019·Granted Jun 15, 2021·2 cites·3 claims
- 0465US10943846B2Chip package structure with heat conductive component and manufacturing thereofUNIMICRON TECHNOLOGY CORP·Filed 2018·Granted Mar 9, 2021·1 cites·7 claims
- 0562US11828754B2Modified electrode, manufacturing method thereof and use thereofUNIV NAT CHENG KUNG·Filed 2022·Granted Nov 28, 2023·0 cites·8 claims
- 0659US12253727B2Electronic deviceUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted Mar 18, 2025·0 cites·11 claims
- 0755US2021159142A1Manufacturing method of chip package structureUNIMICRON TECHNOLOGY CORP·Filed 2021·Application pending·0 cites
- 0852US11937366B2Circuit signal enhancement method of circuit board and structure thereofUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted Mar 19, 2024·0 cites·4 claims
- 0949US10998258B2Circuit carrier and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2019·Granted May 4, 2021·0 cites·10 claims
- 1048US11508642B2Power module package structureAMULAIRE THERMAL TECH INC·Filed 2020·Granted Nov 22, 2022·0 cites·6 claims
- 1146US10629511B2Heat dissipation substrate, manufacturing method thereof and chip package structureUNIMICRON TECHNOLOGY CORP·Filed 2018·Granted Apr 21, 2020·0 cites·14 claims
- 1243US11081421B2IGBT module with heat dissipation structure having ceramic layers corresponding in position and in area to chipsAMULAIRE THERMAL TECH INC·Filed 2019·Granted Aug 3, 2021·0 cites·7 claims
- 1340US10964634B2Method of manufacturing circuit carrier with embedded semiconductor substrateUNIMICRON TECHNOLOGY CORP·Filed 2018·Granted Mar 30, 2021·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →