Inventor · disambiguated record
Tzu-Yang Wu
Also filed as: WU TZU-YANG
7 granted patents·5 pending applications·50 citations·filing 2004–2008
83Inventor score
Top patents by PatentIndex Score
12 records- 0187US7494830B2Method and device for wafer backside alignment overlay accuracyTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Feb 24, 2009·23 cites·14 claims
- 0285US7450296B2Method and system for patterning alignment marks on a transparent substrateTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Nov 11, 2008·13 cites·12 claims
- 0370US7611960B2Method and system for wafer backside alignmentTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Nov 3, 2009·5 cites·18 claims
- 0464US7294279B2Method for releasing a micromechanical structureTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Nov 13, 2007·2 cites·11 claims
- 0556US7183171B2Pyramid-shaped capacitor structureTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Feb 27, 2007·2 cites·14 claims
- 0655US7205176B2Surface MEMS mirrors with oxide spacersTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Apr 17, 2007·5 cites·18 claims
- 0751US7838386B2Method and system for patterning alignment marks on a transparent substrateTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted Nov 23, 2010·0 cites·10 claims
- 0842US2008061030A1Methods for patterning indium tin oxide filmsTAIWAN SEMICONDUCTOR MFG·Filed 2006·Application pending·0 cites
- 0936US2006199393A1H20 plasma and h20 vapor methods for releasing chargesTAIWAN SEMICONDUCTOR MFG·Filed 2006·Application pending·0 cites
- 1033US2006175290A1Photo resist stripping and de-charge method for metal post etching to prevent metal corrosionTAIWAN SEMICONDUCTOR MFG·Filed 2005·Application pending·0 cites
- 1132US2005287814A1H2O plasma for simultaneous resist removal and charge releasingTAIWAN SEMICONDUCTOR MFG·Filed 2005·Application pending·0 cites
- 1228US2006037933A1Mirror process using tungsten passivation layer for preventing metal-spiking induced mirror bridging and improving mirror curvatureWANG WEI-YA·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →