Inventor · disambiguated record
U-Ting Chen
Also filed as: CHEN U-TING
24 granted patents·5 pending applications·74 citations·filing 2012–2025
94Inventor score
Top patents by PatentIndex Score
29 records- 0195US9553020B2Interconnect structure for connecting dies and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 24, 2017·12 cites·20 claims
- 0292US9917121B2BSI image sensor and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Mar 13, 2018·6 cites·20 claims
- 0392US9412719B23DIC interconnect apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Aug 9, 2016·10 cites·20 claims
- 0491US10304818B2Method of manufacturing semiconductor devices having conductive plugs with varying widthsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 28, 2019·5 cites·18 claims
- 0591US10056353B23DIC interconnect apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Aug 21, 2018·9 cites·20 claims
- 0691US2025364494A13DIC Interconnect Apparatus and MethodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0790US11798916B23DIC interconnect apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 24, 2023·5 cites·7 claims
- 0890US9041206B2Interconnect structure and methodTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted May 26, 2015·11 cites·20 claims
- 0986US11315972B2BSI image sensor and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 26, 2022·1 cites·20 claims
- 1085US8952497B2Scribe lines in wafersCHEN U-TING·Filed 2012·Granted Feb 10, 2015·8 cites·20 claims
- 1181US12476224B23DIC interconnect apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Nov 18, 2025·0 cites·20 claims
- 1277US9536920B2Stacked image sensor having a barrier layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jan 3, 2017·3 cites·20 claims
- 1376US12381195B2Semiconductor devices and methods of manufacture thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 5, 2025·0 cites·20 claims
- 1476US11916091B2BSI image sensor and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 27, 2024·0 cites·22 claims
- 1576US10269843B2BSI image sensor and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 23, 2019·1 cites·20 claims
- 1674US10847560B2BSI image sensor and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 24, 2020·0 cites·17 claims
- 1774US10157891B23DIC interconnect apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 18, 2018·1 cites·20 claims
- 1872US9076715B2Interconnect structure for connecting dies and methods of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jul 7, 2015·2 cites·20 claims
- 1964US2024038818A1Semiconductor device and methods of manufacturingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 2061US10510729B23DIC interconnect apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·0 cites·20 claims
- 2160US10818720B2Stacked image sensor having a barrier layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 27, 2020·0 cites·20 claims
- 2260US2025120209A1Image sensor device and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2360US2019279974A1Semiconductor Devices and Methods of Manufacture ThereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Application pending·0 cites
- 2456US9754925B23DIC interconnect apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Sep 5, 2017·0 cites·20 claims
- 2555US2015187701A1Semiconductor Devices and Methods of Manufacture ThereofTAIWAN SEMICONDUCTOR MFG·Filed 2013·Application pending·0 cites
- 2654US10283547B2Stacked image sensor having a barrier layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 7, 2019·0 cites·20 claims
- 2753US9748304B2Image sensor devices, methods of manufacture thereof, and semiconductor device manufacturing methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Aug 29, 2017·0 cites·18 claims
- 2852US9406712B2Interconnect structure for connecting dies and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 2, 2016·0 cites·20 claims
- 2942US9040891B2Image device and methods of forming the sameCHEN U-TING·Filed 2012·Granted May 26, 2015·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →