Inventor · disambiguated record
Un-Byoung Kang
Also filed as: KANG UN-BYOUNG
81 granted patents·44 pending applications·397 citations·filing 2005–2025
99Inventor score
Top patents by PatentIndex Score
125 records- 0197US11676887B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 13, 2023·8 cites·20 claims
- 0297US10177188B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jan 8, 2019·41 cites·17 claims
- 0397US8592991B2Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor deviceLEE HO-JIN·Filed 2011·Granted Nov 26, 2013·31 cites·30 claims
- 0495US7948555B2Camera module and electronic apparatus having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted May 24, 2011·32 cites·17 claims
- 0593US11222873B2Semiconductor packages including stacked substrates and penetration electrodesSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jan 11, 2022·3 cites·20 claims
- 0693US10930613B2Semiconductor package having recessed adhesive layer between stacked chipsSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Feb 23, 2021·9 cites·17 claims
- 0792US9343361B2Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted May 17, 2016·11 cites·16 claims
- 0892US8884416B2Semiconductor apparatus having through vias configured to isolate power supplied to a memory chip from data signals supplied to the memory chipLEE GO EUN·Filed 2010·Granted Nov 11, 2014·51 cites·26 claims
- 0992US8450856B2Semiconductor device and method of forming the sameKANG UN-BYOUNG·Filed 2011·Granted May 28, 2013·18 cites·14 claims
- 1091US11935873B2Methods of inspection of semiconductor packages including measurement of alignment accuracy among semiconductor chipsSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Mar 19, 2024·1 cites·17 claims
- 1191US11694996B2Semiconductor package including a pad contacting a viaSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jul 4, 2023·2 cites·17 claims
- 1290US11948903B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Apr 2, 2024·2 cites·20 claims
- 1389US11315802B2Method for manufacturing semiconductor package having redistribution layerSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Apr 26, 2022·6 cites·18 claims
- 1489US10157766B2Method of fabricating a semiconductor deviceKANG UN BYOUNG·Filed 2014·Granted Dec 18, 2018·13 cites·19 claims
- 1589US9941196B2Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor deviceLEE HO JIN·Filed 2016·Granted Apr 10, 2018·5 cites·16 claims
- 1689US8643179B2Bump structure including nano-wires and a body connecting ends of the nano-wires, semiconductor package having the bump structure and method of manufacturing the semiconductor packageIM YUN-HYEOK·Filed 2011·Granted Feb 4, 2014·11 cites·22 claims
- 1789US7786581B2Method of manufacturing a semiconductor device having an even coating thickness using electro-less plating, and related deviceSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Aug 31, 2010·16 cites·10 claims
- 1888US11114364B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Sep 7, 2021·5 cites·20 claims
- 1988US9023716B2Methods for processing substratesSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted May 5, 2015·8 cites·19 claims
- 2088US7619315B2Stack type semiconductor chip package having different type of chips and fabrication method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Nov 17, 2009·14 cites·11 claims
- 2187US9905550B2Semiconductor package and method of fabricating the sameHAN SANG UK·Filed 2015·Granted Feb 27, 2018·7 cites·20 claims
- 2287US9601465B2Chip-stacked semiconductor package and method of manufacturing the sameKANG UN-BYOUNG·Filed 2014·Granted Mar 21, 2017·8 cites·14 claims
- 2386US12512427B2Semiconductor device including lower pads having different widths and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 30, 2025·1 cites·19 claims
- 2486US11282792B2Semiconductor package having dummy pads and method of manufacturing semiconductor package having dummy padsSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Mar 22, 2022·2 cites·20 claims
- 2586US7495317B2Semiconductor package with ferrite shielding structureSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Feb 24, 2009·14 cites·17 claims
- 2685US10685921B2Semiconductor chip module including a channel for controlling warpage and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jun 16, 2020·4 cites·20 claims
- 2785US7893514B2Image sensor package, method of manufacturing the same, and image sensor module including the image sensor packageSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Feb 22, 2011·14 cites·13 claims
- 2884US2025062248A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2981US11302660B2Semiconductor devices and semiconductor packages including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Apr 12, 2022·1 cites·19 claims
- 3081US10818603B2Semiconductor package having redistribution layerSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Oct 27, 2020·3 cites·20 claims
- 3180US11482554B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 25, 2022·1 cites·11 claims
- 3280US9076881B2Bump structure including nano-wires and a body connecting ends of the nano-wires, semiconductor package having the bump structure and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jul 7, 2015·4 cites·13 claims
- 3379US12165991B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Dec 10, 2024·0 cites·20 claims
- 3479US10535534B2Method of fabricating an interposerSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jan 14, 2020·2 cites·19 claims
- 3579US9478514B2Pre-package and methods of manufacturing semiconductor package and electronic device using the sameCHANG GUN-HO·Filed 2015·Granted Oct 25, 2016·4 cites·20 claims
- 3678US12040294B2Semiconductor devices and semiconductor packages including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jul 16, 2024·0 cites·20 claims
- 3778US10756055B2Stacked image sensor package and stacked image sensor module including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Aug 25, 2020·2 cites·19 claims
- 3878US8633579B2Multi-chip package and method of manufacturing the sameKANG UN-BYOUNG·Filed 2011·Granted Jan 21, 2014·4 cites·14 claims
- 3978US8125042B2Semiconductor package and method of manufacturing the sameKIM JUNG-HWAN·Filed 2009·Granted Feb 28, 2012·10 cites·21 claims
- 4078US2025015009A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 4177US11069541B2Semiconductor device package for debonding substrate assembly from carrier substrate using light and method of manufacturing sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jul 20, 2021·2 cites·20 claims
- 4277US2025323221A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 4376US12119306B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Oct 15, 2024·0 cites·20 claims
- 4476US9761477B2Pre-package and methods of manufacturing semiconductor package and electronic device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Sep 12, 2017·2 cites·20 claims
- 4576US9412636B2Methods for processing substratesSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Aug 9, 2016·2 cites·20 claims
- 4676US9376541B2Non-conductive film and non-conductive paste including zinc particles, semiconductor package including the same, and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jun 28, 2016·4 cites·12 claims
- 4776US8884421B2Multi-chip package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Nov 11, 2014·3 cites·10 claims
- 4876US2024429205A1Semiconductor package with increased thermal radiation efficiencySAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 4976US2025167137A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 5074US12218039B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Feb 4, 2025·0 cites·15 claims
Showing the top 50 of 125 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →