Inventor · disambiguated record
Ursula Q. Quinto
Also filed as: QUINTO URSULA Q
12 granted patents·451 citations·filing 1999–2006
93Inventor score
Top patents by PatentIndex Score
12 records- 0199US6534243B1Chemical feature doubling processADVANCED MICRO DEVICES INC·Filed 2001·Granted Mar 18, 2003·249 cites·20 claims
- 0290US6274289B1Chemical resist thickness reduction processADVANCED MICRO DEVICES INC·Filed 2000·Granted Aug 14, 2001·37 cites·20 claims
- 0383US7591902B2Recirculation and reuse of dummy dispensed resistGLOBALFOUNDRIES INC·Filed 2006·Granted Sep 22, 2009·9 cites·9 claims
- 0480US7153364B1Re-circulation and reuse of dummy-dispensed resistADVANCE MICRO DEVICES INC·Filed 2001·Granted Dec 26, 2006·20 cites·12 claims
- 0575US6593210B1Self-aligned/maskless reverse etch process using an inorganic filmADVANCED MICRO DEVICES INC·Filed 2000·Granted Jul 15, 2003·18 cites·20 claims
- 0669US6362052B1Use of an etch to reduce the thickness and around the edges of a resist mask during the creation of a memory cellADVANCED MICRO DEVICES INC·Filed 2000·Granted Mar 26, 2002·14 cites·22 claims
- 0768US6612319B1Low defect EBR nozzleADVANCED MICRO DEVICES INC·Filed 2000·Granted Sep 2, 2003·12 cites·17 claims
- 0866US6210846B1Exposure during rework for enhanced resist removalADVANCED MICRO DEVICES INC·Filed 1999·Granted Apr 3, 2001·30 cites·18 claims
- 0963US6221777B1Reverse lithographic process for semiconductor viasADVANCED MICRO DEVICES INC·Filed 1999·Granted Apr 24, 2001·28 cites·20 claims
- 1054US6277544B1Reverse lithographic process for semiconductor spacesADVANCED MICRO DEVICES INC·Filed 1999·Granted Aug 21, 2001·19 cites·20 claims
- 1151US6439963B1System and method for mitigating wafer surface disformation during chemical mechanical polishing (CMP)ADVANCED MICRO DEVICES INC·Filed 1999·Granted Aug 27, 2002·14 cites·16 claims
- 1231US6562723B1Hybrid stack method for patterning source/drain areasADVANCED MICRO DEVICES INC·Filed 1999·Granted May 13, 2003·1 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →