Inventor · disambiguated record
Urmi Ray
Also filed as: RAY URMI
12 granted patents·13 pending applications·192 citations·filing 1992–2024
90Inventor score
Top patents by PatentIndex Score
25 records- 0197US9633977B1Integrated device comprising flexible connector between integrated circuit (IC) packagesQUALCOMM INC·Filed 2016·Granted Apr 25, 2017·32 cites·31 claims
- 0294US9583460B2Integrated device comprising stacked dies on redistribution layersQUALCOMM INC·Filed 2014·Granted Feb 28, 2017·19 cites·14 claims
- 0391US9087765B2System-in-package with interposer pitch adapterQUALCOMM INC·Filed 2013·Granted Jul 21, 2015·14 cites·19 claims
- 0490US9209131B2Toroid inductor in redistribution layers (RDL) of an integrated deviceQUALCOMM INC·Filed 2014·Granted Dec 8, 2015·11 cites·20 claims
- 0590US5501761AMethod for stripping conformal coatings from circuit boardsAT & T CORP·Filed 1994·Granted Mar 26, 1996·88 cites·13 claims
- 0689US8710629B2Apparatus and method for controlling semiconductor die warpageBAI XUE·Filed 2009·Granted Apr 29, 2014·20 cites·10 claims
- 0770US12183692B1Embedded inductors and integrated voltage regulators for packaged semiconductor devicesSARAS MICRO DEVICES INC·Filed 2024·Granted Dec 31, 2024·0 cites·20 claims
- 0869US2025226337A1Embedded inductors and integrated voltage regulators for packaged semiconductor devicesSARAS MICRO DEVICES INC·Filed 2024·Application pending·0 cites
- 0965US2025385034A1Embeddable coupled inductors for packaged semiconductor devicesSARAS MICRO DEVICES INC·Filed 2024·Application pending·0 cites
- 1063US9853446B2Integrated circuit (IC) package comprising electrostatic discharge (ESD) protectionQUALCOMM INC·Filed 2015·Granted Dec 26, 2017·1 cites·23 claims
- 1147US2010314725A1Stress Balance Layer on Semiconductor Wafer BacksideQUALCOMM INC·Filed 2009·Application pending·0 cites
- 1245US9510454B2Integrated interposer with embedded active devicesQUALCOMM INC·Filed 2014·Granted Nov 29, 2016·0 cites·16 claims
- 1345US2010155931A1Embedded Through Silicon Stack 3-D Die In A Package SubstrateQUALCOMM INC·Filed 2008·Application pending·0 cites
- 1444US2016049340A1Stress sensor for a semiconductor deviceQUALCOMM INC·Filed 2014·Application pending·0 cites
- 1544US2016095221A1Integration of electronic elements on the backside of a semiconductor dieQUALCOMM INC·Filed 2014·Application pending·0 cites
- 1643US2015048497A1Interposer with electrostatic discharge protectionQUALCOMM INC·Filed 2013·Application pending·0 cites
- 1742US2014306349A1Low cost interposer comprising an oxidation layerQUALCOMM INC·Filed 2013·Application pending·0 cites
- 1839US12500040B2Planar high-density aluminum capacitors for stacking and embeddingSARAS MICRO DEVICES INC·Filed 2021·Granted Dec 16, 2025·0 cites·41 claims
- 1937US2011012239A1Barrier Layer On Polymer Passivation For Integrated Circuit PackagingQUALCOMM INC·Filed 2010·Application pending·0 cites
- 2037US2011193211A1Surface Preparation of Die for Improved Bonding StrengthQUALCOMM INC·Filed 2010·Application pending·0 cites
- 2136US2011193212A1Systems and Methods Providing Arrangements of ViasQUALCOMM INC·Filed 2010·Application pending·0 cites
- 2236US2011227230A1Through-silicon via fabrication with etch stop filmQUALCOMM INC·Filed 2010·Application pending·0 cites
- 2333US2016315024A1Mechanical handling support for thin cores using photo-patternable materialQUALCOMM INC·Filed 2015·Application pending·0 cites
- 2429US5201114AAnalytic method for use in electronic circuit assembly operationsAT & T BELL LAB·Filed 1992·Granted Apr 13, 1993·7 cites·9 claims
- 2521US6260386B1Optical fiber preform cleaning methodLUCENT TECHNOLOGIES INC·Filed 1994·Granted Jul 17, 2001·0 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →