Inventor · disambiguated record
Vance D. Archer, Iii
Also filed as: ARCHER III VANCE D · ARCHER VANCE D · ARCHER VANCE DOLVAN
7 granted patents·1 pending application·146 citations·filing 2004–2012
86Inventor score
Top patents by PatentIndex Score
8 records- 0192US7301231B2Reinforced bond pad for a semiconductor deviceAGERE SYSTEMS INC·Filed 2006·Granted Nov 27, 2007·31 cites·7 claims
- 0291US7429502B2Integrated circuit device incorporating metallurgical bond to enhance thermal conduction to a heat sinkAGERE SYSTEMS INC·Filed 2007·Granted Sep 30, 2008·23 cites·10 claims
- 0390US7115985B2Reinforced bond pad for a semiconductor deviceAGERE SYSTEMS INC·Filed 2004·Granted Oct 3, 2006·65 cites·10 claims
- 0482US8319343B2Routing under bond pad for the replacement of an interconnect layerARCHER III VANCE D·Filed 2006·Granted Nov 27, 2012·13 cites·10 claims
- 0581US7397103B2Semiconductor with damage detection circuitryAGERE SYSTEMS INC·Filed 2005·Granted Jul 8, 2008·11 cites·13 claims
- 0666US7327029B2Integrated circuit device incorporating metallurigical bond to enhance thermal conduction to a heat sinkAGERE SYSTEMS INC·Filed 2005·Granted Feb 5, 2008·3 cites·10 claims
- 0753US7973544B2Thermal monitoring and management of integrated circuitsAGERE SYSTEMS INC·Filed 2008·Granted Jul 5, 2011·0 cites·20 claims
- 0848US2013056868A1Routing under bond pad for the replacement of an interconnect layerAGERE SYSTEMS LLC·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →