Inventor · disambiguated record
Vahid Akhavan Attar
Also filed as: ATTAR VAHID AKHAVAN
3 granted patents·7 pending applications·10 citations·filing 2020–2025
64Inventor score
Top patents by PatentIndex Score
10 records- 0193US11358381B1Method for attaching and detaching substrates during integrated circuit manufacturingNCC NANO LLC·Filed 2021·Granted Jun 14, 2022·6 cites·16 claims
- 0284US11996384B2Method and apparatus for debonding temporarily bonded wafers in wafer-level packaging applicationsNCC NANO LLC·Filed 2020·Granted May 28, 2024·2 cites·5 claims
- 0377US11317517B2Method for connecting surface-mount electronic components to a circuit boardNCC NANO LLC·Filed 2020·Granted Apr 26, 2022·2 cites·20 claims
- 0471US2025022838A1Method and apparatus for debonding temporarily bonded wafers in wafer-level packaging applicationsPULSEFORGE INC·Filed 2024·Application pending·0 cites
- 0568US2025282979A1Photonic debonding for wafer-level packaging applicationsBREWER SCIENCE INC·Filed 2025·Application pending·0 cites
- 0658US2024384045A1Method for curing and releasing thermosetting polymers on a coated glass substratePULSEFORGE INC·Filed 2023·Application pending·0 cites
- 0752US2024213400A1Method for integrating semiconductor chips on a substrateTURKANI VIKRAM SHREESHAIL·Filed 2022·Application pending·0 cites
- 0843US2025323207A1Method for bonding electronics structures during integrated electronics manufacturingPULSEFORGE INC·Filed 2025·Application pending·0 cites
- 0943US2025299995A1Roughened Carrier for Debonding of Bonded StackPULSEFORGE INC·Filed 2025·Application pending·0 cites
- 1042US2022306177A1Method for attaching and detaching substrates during integrated circuit manufacturingPULSEFORGE INC·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →