Inventor · disambiguated record
Valentin Kosenko
Also filed as: KOSENKO VALENTIN
12 granted patents·5 pending applications·89 citations·filing 2006–2024
90Inventor score
Top patents by PatentIndex Score
17 records- 0195US7510928B2Dielectric trenches, nickel/tantalum oxide structures, and chemical mechanical polishing techniquesTRU SI TECHNOLOGIES INC·Filed 2006·Granted Mar 31, 2009·31 cites·4 claims
- 0291US9018094B2Substrates with through vias with conductive features for connection to integrated circuit elements, and methods for forming through vias in substratesKOSENKO VALENTIN·Filed 2011·Granted Apr 28, 2015·15 cites·32 claims
- 0390US9111902B2Dielectric trenches, nickel/tantalum oxide structures, and chemical mechanical polishing techniquesINVENSAS CORP·Filed 2014·Granted Aug 18, 2015·8 cites·11 claims
- 0487US7964508B2Dielectric trenches, nickel/tantalum oxide structures, and chemical mechanical polishing techniquesALLVIA INC·Filed 2008·Granted Jun 21, 2011·16 cites·6 claims
- 0582US8757897B2Optical interposerKOSENKO VALENTIN·Filed 2012·Granted Jun 24, 2014·7 cites·52 claims
- 0680US8431431B2Structures with through vias passing through a substrate comprising a planar insulating layer between semiconductor layersKOSENKO VALENTIN·Filed 2011·Granted Apr 30, 2013·4 cites·12 claims
- 0774US9589879B2Substrates with through vias with conductive features for connection to integrated circuit elements, and methods for forming through vias in substratesINVENSAS CORP·Filed 2015·Granted Mar 7, 2017·2 cites·25 claims
- 0870US9323010B2Structures formed using monocrystalline silicon and/or other materials for optical and other applicationsKOSENKO VALENTIN·Filed 2012·Granted Apr 26, 2016·3 cites·13 claims
- 0966US8829683B2Structures with through vias passing through a substrate comprising a planar insulating layer between semiconductor layersINVENSAS CORP·Filed 2013·Granted Sep 9, 2014·1 cites·8 claims
- 1061US2025344614A1Modular Quantum Processor Configurations and Module Integration Plate with Inter-Module Connections for SameRIGETTI & CO LLC·Filed 2024·Application pending·0 cites
- 1160US8633589B2Dielectric trenches, nickel/tantalum oxide structures, and chemical mechanical polishing techniquesSAVASTIOUK SERGEY·Filed 2007·Granted Jan 21, 2014·2 cites·19 claims
- 1258US9142511B2Structures with through vias passing through a substrate comprising a planar insulating layer between semiconductor layersINVENSAS CORP·Filed 2014·Granted Sep 22, 2015·0 cites·8 claims
- 1355US2025077926A1Multi-Layered Cap Wafers for Modular Quantum Processing UnitsRIGETTI & CO LLC·Filed 2024·Application pending·0 cites
- 1453US9515024B2Structures with through vias passing through a substrate comprising a planar insulating layer between semiconductorINVENSAS CORP·Filed 2015·Granted Dec 6, 2016·0 cites·14 claims
- 1545US2008164574A1Integrated circuits with conductive features in through holes passing through other conductive features and through a semiconductor substrateSAVASTIOUK SERGEY·Filed 2008·Application pending·0 cites
- 1642US2008136038A1Integrated circuits with conductive features in through holes passing through other conductive features and through a semiconductor substrateSAVASTIOUK SERGEY·Filed 2006·Application pending·0 cites
- 1741US2008271995A1Agitation of electrolytic solution in electrodepositionSAVASTIOUK SERGEY·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →