Inventor · disambiguated record
Vahid Vahedi
Also filed as: VAHEDI VAHID
41 granted patents·3 pending applications·1,645 citations·filing 1996–2018
98Inventor score
Top patents by PatentIndex Score
44 records- 0198US7932181B2Edge gas injection for critical dimension uniformity improvementLAM RES CORP·Filed 2006·Granted Apr 26, 2011·185 cites·19 claims
- 0298US6841943B2Plasma processor with electrode simultaneously responsive to plural frequenciesLAM RES CORP·Filed 2002·Granted Jan 11, 2005·115 cites·70 claims
- 0397US10197908B2Photoresist design layout pattern proximity correction through fast edge placement error prediction via a physics-based etch profile modeling frameworkLAM RES CORP·Filed 2016·Granted Feb 5, 2019·27 cites·32 claims
- 0497US10056225B2Adjusting substrate temperature to improve CD uniformityLAM RES CORP·Filed 2013·Granted Aug 21, 2018·36 cites·11 claims
- 0597US9972478B2Method and process of implementing machine learning in complex multivariate wafer processing equipmentLAM RES CORP·Filed 2016·Granted May 15, 2018·23 cites·14 claims
- 0696US9245761B2Internal plasma grid for semiconductor fabricationLAM RES CORP·Filed 2013·Granted Jan 26, 2016·21 cites·19 claims
- 0795US10615009B2System implementing machine learning in complex multivariate wafer processing equipmentLAM RES CORP·Filed 2018·Granted Apr 7, 2020·10 cites·16 claims
- 0895US10403475B2Tunable multi-zone gas injection systemLAM RES CORP·Filed 2015·Granted Sep 3, 2019·13 cites·16 claims
- 0995US8642480B2Adjusting substrate temperature to improve CD uniformityGAFF KEITH WILLIAM·Filed 2010·Granted Feb 4, 2014·22 cites·16 claims
- 1094US10585347B2Photoresist design layout pattern proximity correction through fast edge placement error prediction via a physics-based etch profile modeling frameworkLAM RES CORP·Filed 2018·Granted Mar 10, 2020·9 cites·21 claims
- 1194US6921724B2Variable temperature processes for tunable electrostatic chuckLAM RES CORP·Filed 2002·Granted Jul 26, 2005·102 cites·26 claims
- 1294US6218309B1Method of achieving top rounding and uniform etch depths while etching shallow trench isolation featuresLAM RES CORP·Filed 1999·Granted Apr 17, 2001·177 cites·33 claims
- 1394US5913140AMethod for reduction of plasma charging damage during chemical vapor depositionLAM RES CORP·Filed 1996·Granted Jun 15, 1999·239 cites·8 claims
- 1493US10224221B2Internal plasma grid for semiconductor fabricationLAM RES CORP·Filed 2016·Granted Mar 5, 2019·7 cites·20 claims
- 1593US6804572B1Enhanced process and profile simulator algorithmsLAM RES CORP·Filed 2000·Granted Oct 12, 2004·34 cites·7 claims
- 1693US6776851B1In-situ cleaning of a polymer coated plasma processing chamberLAM RES CORP·Filed 2002·Granted Aug 17, 2004·49 cites·13 claims
- 1792US6344105B1Techniques for improving etch rate uniformityLAM RES CORP·Filed 1999·Granted Feb 5, 2002·141 cites·29 claims
- 1891US6151532AMethod and apparatus for predicting plasma-process surface profilesLAM RES CORP·Filed 1998·Granted Nov 21, 2000·70 cites·28 claims
- 1989US7139632B2Enhanced process and profile simulator algorithmsLAM RES CORP·Filed 2004·Granted Nov 21, 2006·21 cites·11 claims
- 2088US7138067B2Methods and apparatus for tuning a set of plasma processing stepsLAM RES CORP·Filed 2004·Granted Nov 21, 2006·41 cites·9 claims
- 2187US6093332AMethods for reducing mask erosion during plasma etchingLAM RES CORP·Filed 1998·Granted Jul 25, 2000·46 cites·14 claims
- 2285US9018103B2High aspect ratio etch with combination maskLAM RES CORP·Filed 2013·Granted Apr 28, 2015·5 cites·16 claims
- 2384US6033585AMethod and apparatus for preventing lightup of gas distribution holesLAM RES CORP·Filed 1996·Granted Mar 7, 2000·47 cites·20 claims
- 2483US6489245B1Methods for reducing mask erosion during plasma etchingLAM RES CORP·Filed 2000·Granted Dec 3, 2002·16 cites·8 claims
- 2581US6577915B1Applications of a semi-empirical, physically based, profile simulatorLAM RES CORP·Filed 2000·Granted Jun 10, 2003·11 cites·18 claims
- 2680US9818633B2Equipment front end module for transferring wafers and method of transferring wafersLAM RES CORP·Filed 2014·Granted Nov 14, 2017·5 cites·19 claims
- 2780US6301510B1Method and apparatus to calibrate a semi-empirical process simulatorLAM RES CORP·Filed 2000·Granted Oct 9, 2001·10 cites·19 claims
- 2879US7018780B2Methods for controlling and reducing profile variation in photoresist trimmingLAM RES CORP·Filed 2003·Granted Mar 28, 2006·24 cites·22 claims
- 2978US6316169B1Methods for reducing profile variation in photoresist trimmingLAM RES CORP·Filed 1999·Granted Nov 13, 2001·51 cites·19 claims
- 3076US6994769B2In-situ cleaning of a polymer coated plasma processing chamberLAM RES CORP·Filed 2004·Granted Feb 7, 2006·25 cites·9 claims
- 3173USRE39534EMethod and apparatus to calibrate a semi-empirical process simulatorLAM RES CORP·Filed 2002·Granted Mar 27, 2007·6 cites·18 claims
- 3271US8525139B2Method and apparatus of halogen removalSINGH HARMEET·Filed 2010·Granted Sep 3, 2013·3 cites·20 claims
- 3370US7578945B2Method and apparatus for tuning a set of plasma processing stepsLAM RES CORP·Filed 2006·Granted Aug 25, 2009·3 cites·15 claims
- 3469US7682980B2Method to improve profile control and N/P loading in dual doped gate applicationsLAM RES CORP·Filed 2007·Granted Mar 23, 2010·3 cites·10 claims
- 3567US9659783B2High aspect ratio etch with combination maskLAM RES CORP·Filed 2015·Granted May 23, 2017·1 cites·16 claims
- 3664US7204934B1Method for planarization etch with in-situ monitoring by interferometry prior to recess etchLAM RES CORP·Filed 2001·Granted Apr 17, 2007·10 cites·23 claims
- 3759US6168690B1Methods and apparatus for physical vapor depositionLAM RES CORP·Filed 1997·Granted Jan 2, 2001·21 cites·21 claims
- 3858US7186661B2Method to improve profile control and N/P loading in dual doped gate applicationsLAM RES CORP·Filed 2003·Granted Mar 6, 2007·6 cites·3 claims
- 3957US2014302681A1Internal plasma grid for semiconductor fabricationLAM RES CORP·Filed 2013·Application pending·0 cites
- 4056US6653058B2Methods for reducing profile variation in photoresist trimmingLAM RES CORP·Filed 2001·Granted Nov 25, 2003·5 cites·21 claims
- 4155US6618638B1Method for scaling processes between different etching chambers and wafer sizesLAM RES CORP·Filed 2001·Granted Sep 9, 2003·5 cites·10 claims
- 4252US2009261065A1Components for use in a plasma chamber having reduced particle generation and method of makingLAM RES CORP·Filed 2009·Application pending·0 cites
- 4346US10242883B2High aspect ratio etch of oxide metal oxide metal stackLAM RES CORP·Filed 2017·Granted Mar 26, 2019·0 cites·18 claims
- 4439US2003070620A1Tunable multi-zone gas injection systemFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →