Inventor · disambiguated record
Veronica Strong
Also filed as: STRONG VERONICA · STRONG VERONICA A · STRONG VERONICA ALEMAN
45 granted patents·37 pending applications·59 citations·filing 2012–2025
96Inventor score
Top patents by PatentIndex Score
82 records- 0196US11527501B1Sacrificial redistribution layer in microelectronic assemblies having direct bondingINTEL CORP·Filed 2020·Granted Dec 13, 2022·7 cites·11 claims
- 0295US9779884B2Capacitor with electrodes made of an interconnected corrugated carbon-based networkUNIV CALIFORNIA·Filed 2013·Granted Oct 3, 2017·11 cites·66 claims
- 0394US11728258B2Electroless metal-defined thin pad first level interconnects for lithographically defined viasINTEL CORP·Filed 2021·Granted Aug 15, 2023·2 cites·6 claims
- 0492US11049791B1Heat spreading layer integrated within a composite IC die structure and methods of forming the sameINTEL CORP·Filed 2019·Granted Jun 29, 2021·7 cites·22 claims
- 0591US11147197B2Microelectronic package electrostatic discharge (ESD) protectionINTEL CORP·Filed 2019·Granted Oct 12, 2021·5 cites·20 claims
- 0691US11133263B2High-density interconnects for integrated circuit packagesINTEL CORP·Filed 2019·Granted Sep 28, 2021·6 cites·22 claims
- 0790US10648958B2Interconnected corrugated carbon-based networkUNIV CALIFORNIA·Filed 2017·Granted May 12, 2020·2 cites·20 claims
- 0887US12400934B2Dielectric film coating for through glass vias and plane surface roughness mitigationINTEL CORP·Filed 2021·Granted Aug 26, 2025·1 cites·17 claims
- 0986US11004618B2Capacitor with electrodes made of an interconnected corrugated carbon-based networkUNIV CALIFORNIA·Filed 2017·Granted May 11, 2021·2 cites·19 claims
- 1085US11397173B2Interconnected corrugated carbon-based networkUNIV CALIFORNIA·Filed 2020·Granted Jul 26, 2022·1 cites·18 claims
- 1183US11348882B2Package spark gap structureINTEL CORP·Filed 2019·Granted May 31, 2022·3 cites·20 claims
- 1281US11296040B2Electrostatic discharge protection in integrated circuitsINTEL CORP·Filed 2019·Granted Apr 5, 2022·2 cites·12 claims
- 1381US11264373B2Die backend diodes for electrostatic discharge (ESD) protectionINTEL CORP·Filed 2019·Granted Mar 1, 2022·2 cites·12 claims
- 1480US11424239B2Diodes for package substrate electrostatic discharge (ESD) protectionINTEL CORP·Filed 2019·Granted Aug 23, 2022·2 cites·20 claims
- 1578US11189580B2Electrostatic discharge protection in integrated circuitsINTEL CORP·Filed 2019·Granted Nov 30, 2021·2 cites·19 claims
- 1678US2025343114A1Dielectric film coating for through glass vias and plane surface roughness mitigationINTEL CORP·Filed 2025·Application pending·0 cites
- 1777US11915870B2Capacitor with electrodes made of an interconnected corrugated carbon-based networkUNIV CALIFORNIA·Filed 2022·Granted Feb 27, 2024·0 cites·20 claims
- 1877US11257745B2Electroless metal-defined thin pad first level interconnects for lithographically defined viasINTEL CORP·Filed 2017·Granted Feb 22, 2022·2 cites·11 claims
- 1976US12153032B2Interconnected corrugated carbon-based networkUNIV CALIFORNIA·Filed 2022·Granted Nov 26, 2024·0 cites·19 claims
- 2076US10998272B2Organic interposers for integrated circuit packagesINTEL CORP·Filed 2019·Granted May 4, 2021·2 cites·25 claims
- 2170US11676918B2Electrostatic discharge protection in integrated circuitsINTEL CORP·Filed 2022·Granted Jun 13, 2023·0 cites·20 claims
- 2269US11664303B2Interconnection structure fabrication using grayscale lithographyINTEL CORP·Filed 2021·Granted May 30, 2023·0 cites·20 claims
- 2369US2025109221A1Cross-linked hydrophobic coating with plasma resistance for die-to-wafer self-alignment assisted assemblyINTEL CORP·Filed 2023·Application pending·0 cites
- 2468US11784181B2Die backend diodes for electrostatic discharge (ESD) protectionINTEL CORP·Filed 2022·Granted Oct 10, 2023·0 cites·20 claims
- 2568US11751367B2Microelectronic package electrostatic discharge (ESD) protectionINTEL CORP·Filed 2021·Granted Sep 5, 2023·0 cites·20 claims
- 2667US11581238B2Heat spreading layer integrated within a composite IC die structure and methods of forming the sameINTEL CORP·Filed 2021·Granted Feb 14, 2023·0 cites·20 claims
- 2767US11257632B2Capacitor with electrodes made of an interconnected corrugated carbon-based networkUNIV CALIFORNIA·Filed 2018·Granted Feb 22, 2022·0 cites·22 claims
- 2866US11749628B2Sacrificial redistribution layer in microelectronic assemblies having direct bondingINTEL CORP·Filed 2022·Granted Sep 5, 2023·0 cites·15 claims
- 2965US11694951B2Zero-misalignment two-via structuresINTEL CORP·Filed 2021·Granted Jul 4, 2023·0 cites·21 claims
- 3064US2022102270A1Conductive contact structures for electrostatic discharge protection in integrated circuitsINTEL CORP·Filed 2021·Application pending·0 cites
- 3164US2022093531A1Package-integrated bistable switch for electrostatic discharge (esd) protectionINTEL CORP·Filed 2021·Application pending·0 cites
- 3263US12205902B2High-density interconnects for integrated circuit packagesINTEL CORP·Filed 2021·Granted Jan 21, 2025·0 cites·20 claims
- 3363US2016077074A1Interconnected corrugated carbon-based networkUNIV CALIFORNIA·Filed 2012·Application pending·0 cites
- 3463US2025054672A1Selectively transferred inductors with electroplated magnetic materialINTEL CORP·Filed 2023·Application pending·0 cites
- 3562US12347761B2Magnetic planar spiral and high aspect ratio inductors for power delivery in the glass-core of a package substrateINTEL CORP·Filed 2021·Granted Jul 1, 2025·0 cites·23 claims
- 3662US10418605B2Embedded formation of wearable and flexible batteriesINTEL CORP·Filed 2017·Granted Sep 17, 2019·0 cites·23 claims
- 3761US11239155B2Conductive contact structures for electrostatic discharge protection in integrated circuitsINTEL CORP·Filed 2019·Granted Feb 1, 2022·0 cites·14 claims
- 3861US11222856B2Package-integrated bistable switch for electrostatic discharge (ESD) protectionINTEL CORP·Filed 2019·Granted Jan 11, 2022·0 cites·19 claims
- 3959US12424716B2RF filters and multiplexers manufactured in the core of a package substrate using glass core technologyINTEL CORP·Filed 2021·Granted Sep 23, 2025·0 cites·25 claims
- 4059US12368091B2Package substrate with glass core having vertical power planes for improved power deliveryINTEL CORP·Filed 2021·Granted Jul 22, 2025·0 cites·25 claims
- 4159US2025210392A1Handling assembly, handling system and methodINTEL CORP·Filed 2023·Application pending·0 cites
- 4259US2025218847A1Configurable carrier for transfer and self-assembly of multiple integrated circuit devicesINTEL CORP·Filed 2023·Application pending·0 cites
- 4358US12444619B2Physical vapor deposition seeding for high aspect ratio vias in glass core technologyINTEL CORP·Filed 2021·Granted Oct 14, 2025·0 cites·11 claims
- 4458US11101205B2Interconnection structure fabrication using grayscale lithographyINTEL CORP·Filed 2019·Granted Aug 24, 2021·0 cites·8 claims
- 4558US2025112127A1Ic assemblies with metal passivation at bond interfacesINTEL CORP·Filed 2023·Application pending·0 cites
- 4657US12424719B2Compact surface transmission line waveguides with vertical ground planesINTEL CORP·Filed 2021·Granted Sep 23, 2025·0 cites·24 claims
- 4757US2025273557A1Laser debond process for fabrication of high-density organic interposersINTEL CORP·Filed 2024·Application pending·0 cites
- 4856US2024339381A1Air-gap traces and air-gap embedded bridge integrated in glass interposerINTEL CORP·Filed 2023·Application pending·0 cites
- 4955US11222836B2Zero-misalignment two-via structuresINTEL CORP·Filed 2017·Granted Jan 11, 2022·0 cites·25 claims
- 5054US2024006292A1Alignment via-pad and via-plane structuresINTEL CORP·Filed 2022·Application pending·0 cites
Showing the top 50 of 82 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →