Inventor · disambiguated record
Vivek Kishorechand Arora
Also filed as: ARORA VIVEK · ARORA VIVEK K · ARORA VIVEK KISHORECHAND
35 granted patents·24 pending applications·181 citations·filing 1996–2024
95Inventor score
Files withTEXAS INSTRUMENTS INC52SLOAN KETTERING INST CANCER RES2AT & T CORP1BLACKSPARK CORP1CITIGROUP GLOBAL MARKETS INC1
Top patents by PatentIndex Score
59 records- 0197US12136588B2Heat slug attached to a die pad for semiconductor packageTEXAS INSTRUMENTS INC·Filed 2021·Granted Nov 5, 2024·4 cites·26 claims
- 0290USD829749SDisplay screen with transitional graphical user interface of a financial markets orders and executed trades viewer applicationCITIGROUP GLOBAL MARKETS INC·Filed 2017·Granted Oct 2, 2018·81 cites·1 claims
- 0386US11387179B2IC package with half-bridge power moduleTEXAS INSTRUMENTS INC·Filed 2020·Granted Jul 12, 2022·2 cites·20 claims
- 0479US11329025B2Multi-chip package with reinforced isolationTEXAS INSTRUMENTS INC·Filed 2020·Granted May 10, 2022·1 cites·31 claims
- 0578US11031332B2Package panel processing with integrated ceramic isolationTEXAS INSTRUMENTS INC·Filed 2019·Granted Jun 8, 2021·2 cites·26 claims
- 0676US2025022782A1Heat slug attached to a die pad for semiconductor packageTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 0773US12482711B2Half bridge ceramic hermetic package structureTEXAS INSTRUMENTS INC·Filed 2022·Granted Nov 25, 2025·0 cites·20 claims
- 0873US12482718B2Thermally enhanced embedded die packageTEXAS INSTRUMENTS INC·Filed 2022·Granted Nov 25, 2025·0 cites·16 claims
- 0973US2024222237A1Isolated semiconductor package with hv isolator on blockTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 1073US2025087591A1Frame design in embedded die packageTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 1172US10580715B2Stress buffer layer in embedded packageTEXAS INSTRUMENTS INC·Filed 2018·Granted Mar 3, 2020·1 cites·20 claims
- 1272US10580722B1High voltage flip-chip on lead (FOL) packageTEXAS INSTRUMENTS INC·Filed 2018·Granted Mar 3, 2020·1 cites·20 claims
- 1372US5812552AMethod and apparatus for dynamically forming multimedia emulated local area networksAT & T CORP·Filed 1996·Granted Sep 22, 1998·88 cites·45 claims
- 1471US12456707B2Stacked clip design for GaN half bridge IPMTEXAS INSTRUMENTS INC·Filed 2022·Granted Oct 28, 2025·0 cites·19 claims
- 1570US10748827B2Packaged semiconductor devices for high voltage with die edge protectionTEXAS INSTRUMENTS INC·Filed 2018·Granted Aug 18, 2020·1 cites·15 claims
- 1670US2023378034A1Power stage package including flexible circuit and stacked dieTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 1769US12125799B2Embedded die packaging with integrated ceramic substrateTEXAS INSTRUMENTS INC·Filed 2021·Granted Oct 22, 2024·0 cites·15 claims
- 1869US11923281B2Semiconductor package with isolated heat spreaderTEXAS INSTRUMENTS INC·Filed 2022·Granted Mar 5, 2024·0 cites·18 claims
- 1969US11908834B2Multi-chip package with reinforced isolationTEXAS INSTRUMENTS INC·Filed 2022·Granted Feb 20, 2024·0 cites·20 claims
- 2068US2023413467A1Power conversion moduleTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 2167US2023198422A1Power converter moduleTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 2266US11869839B2Package panel processing with integrated ceramic isolationTEXAS INSTRUMENTS INC·Filed 2021·Granted Jan 9, 2024·0 cites·20 claims
- 2365US12476170B2High voltage flip-chip on lead (FOL) packageTEXAS INSTRUMENTS INC·Filed 2020·Granted Nov 18, 2025·0 cites·18 claims
- 2465US11929311B2Isolated semiconductor package with HV isolator on blockTEXAS INSTRUMENTS INC·Filed 2021·Granted Mar 12, 2024·0 cites·23 claims
- 2565US11601065B1Power converter moduleTEXAS INSTRUMENTS INC·Filed 2021·Granted Mar 7, 2023·0 cites·20 claims
- 2665US10919929B2Glucocorticoid inhibitors for treatment of prostate cancerSLOAN KETTERING INST CANCER RES·Filed 2014·Granted Feb 16, 2021·0 cites·7 claims
- 2764US11183441B2Stress buffer layer in embedded packageTEXAS INSTRUMENTS INC·Filed 2020·Granted Nov 23, 2021·0 cites·20 claims
- 2862US11302615B2Semiconductor package with isolated heat spreaderTEXAS INSTRUMENTS INC·Filed 2020·Granted Apr 12, 2022·0 cites·15 claims
- 2961US12412840B2Power module with multi-layer substrate and second insulation layer to increase power densityTEXAS INSTRUMENTS INC·Filed 2022·Granted Sep 9, 2025·0 cites·14 claims
- 3061US11751353B2Power conversion module and method of forming the sameTEXAS INSTRUMENTS INC·Filed 2021·Granted Sep 5, 2023·0 cites·20 claims
- 3160US11417579B2Packaged semiconductor devices for high voltage with die edge protectionTEXAS INSTRUMENTS INC·Filed 2020·Granted Aug 16, 2022·0 cites·6 claims
- 3259US12400939B2Packaged semiconductor device including heat slugTEXAS INSTRUMENTS INC·Filed 2021·Granted Aug 26, 2025·0 cites·34 claims
- 3358US12154861B2Frame design in embedded die packageTEXAS INSTRUMENTS INC·Filed 2019·Granted Nov 26, 2024·0 cites·23 claims
- 3458US11715679B2Power stage package including flexible circuit and stacked dieTEXAS INSTRUMENTS INC·Filed 2019·Granted Aug 1, 2023·0 cites·18 claims
- 3558US2025140624A1Packages with isolated diesTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 3658US2025112114A1Semiconductor device package with integral thermal dissipation structureTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 3757US2021179660A1Glucocorticoid inhibitors for treatment of prostate cancerSLOAN KETTERING INST CANCER RES·Filed 2020·Application pending·0 cites
- 3856US11183460B2Embedded die packaging with integrated ceramic substrateTEXAS INSTRUMENTS INC·Filed 2018·Granted Nov 23, 2021·0 cites·22 claims
- 3955US2025372509A1Microelectronic device package with hybrid isolation laminateTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 4054US2024071892A1Molded package with press-fit conductive pinsTEXAS INSTRUMENTS INC·Filed 2022·Application pending·0 cites
- 4153US2023386963A1Power converter moduleTEXAS INSTRUMENTS INC·Filed 2022·Application pending·0 cites
- 4252US2022318929A1System and Method for Automated Electronic Tax Preparation and FilingBLACKSPARK CORP·Filed 2021·Application pending·0 cites
- 4352US2023245942A1Semiconductor device package with integral heat slugTEXAS INSTRUMENTS INC·Filed 2022·Application pending·0 cites
- 4451US11870341B2Isolated power converter package with molded transformerTEXAS INSTRUMENTS INC·Filed 2022·Granted Jan 9, 2024·0 cites·20 claims
- 4551US11075147B2Stacked die semiconductor packageTEXAS INSTRUMENTS INC·Filed 2019·Granted Jul 27, 2021·0 cites·19 claims
- 4651US2023378022A1Power module integrated circuit packageTEXAS INSTRUMENTS INC·Filed 2022·Application pending·0 cites
- 4751US2023207420A1Integrated circuit having an improved thermal integrated circuit having an improved thermal performanceTEXAS INSTRUMENTS INC·Filed 2021·Application pending·0 cites
- 4850US10879155B2Electronic device with double-sided coolingTEXAS INSTRUMENTS INC·Filed 2019·Granted Dec 29, 2020·0 cites·35 claims
- 4950US2024038429A1Stacked magnetic compound molded integrated isolation transformerTEXAS INSTRUMENTS INC·Filed 2022·Application pending·0 cites
- 5049US2023059142A1Flip chip packaged devices with thermal interposerTEXAS INSTRUMENTS INC·Filed 2021·Application pending·0 cites
Showing the top 50 of 59 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →