Inventor · disambiguated record
Vikas Gupta
Also filed as: GUPTA VIKAS · GUPTA VIKAS I
45 granted patents·21 pending applications·1,145 citations·filing 1994–2025
98Inventor score
Files withTEXAS INSTRUMENTS INC44TINI ALLOY CO6MICROPYRETICS HEATERS INT2TATA CONSUMER PRODUCTS LTD2ADVANCED SEMICONDUCTOR ENG1
Top patents by PatentIndex Score
66 records- 0199US7892889B2Array-processed stacked semiconductor packagesTEXAS INSTRUMENTS INC·Filed 2009·Granted Feb 22, 2011·136 cites·5 claims
- 0295US7956456B2Thermal interface material design for enhanced thermal performance and improved package structural integrityTEXAS INSTRUMENTS INC·Filed 2008·Granted Jun 7, 2011·37 cites·7 claims
- 0394US6624730B2Thin film shape memory alloy actuated microrelayTINI ALLOY CO·Filed 2001·Granted Sep 23, 2003·74 cites·5 claims
- 0493US6533905B2Method for sputtering tini shape-memory alloysTINI ALLOY CO·Filed 2001·Granted Mar 18, 2003·226 cites·11 claims
- 0590US7838988B1Stud bumps as local heat sinks during transient power operationsTEXAS INSTRUMENTS INC·Filed 2009·Granted Nov 23, 2010·18 cites·12 claims
- 0689US10083896B1Methods and apparatus for a semiconductor device having bi-material die attach layerTEXAS INSTRUMENTS INC·Filed 2017·Granted Sep 25, 2018·5 cites·16 claims
- 0789US9682286B2Ball for ball games, and method for manufacturing ball for ball gamesSHISHIDO HIDEOMI·Filed 2016·Granted Jun 20, 2017·7 cites·7 claims
- 0889US6746890B2Three dimensional thin film devices and methods of fabricationTINI ALLOY CO·Filed 2002·Granted Jun 8, 2004·229 cites·21 claims
- 0988US7981258B2Thin-film shape memory alloy device and methodSTRYKER CORP·Filed 2009·Granted Jul 19, 2011·9 cites·12 claims
- 1087US6143594AOn-chip ESD protection in dual voltage CMOSTEXAS INSTRUMENTS INC·Filed 2000·Granted Nov 7, 2000·40 cites·5 claims
- 1186US6790298B2Method of fabrication of free standing shape memory alloy thin filmTINI ALLOY CO·Filed 2001·Granted Sep 14, 2004·70 cites·7 claims
- 1286US5766458AModulated and regenerative ceramic filter with insitu heating elementMICROPYRETICS HEATERS INT·Filed 1994·Granted Jun 16, 1998·64 cites·25 claims
- 1385US10916448B2Method for creating a wettable surface for improved reliability in QFN packagesTEXAS INSTRUMENTS INC·Filed 2018·Granted Feb 9, 2021·3 cites·12 claims
- 1485US7084726B2Thin film shape memory alloy actuated microrelayTINI ALLOY CO·Filed 2003·Granted Aug 1, 2006·29 cites·10 claims
- 1584US10475729B2Packaged semiconductor device with a particle roughened surfaceTEXAS INSTRUMENTS INC·Filed 2019·Granted Nov 12, 2019·3 cites·20 claims
- 1683US7989949B2Heat extraction from packaged semiconductor chips, scalable with chip areaTEXAS INSTRUMENTS INC·Filed 2009·Granted Aug 2, 2011·9 cites·18 claims
- 1782US5655212APorous membranesMICROPYRETICS HEATERS INT·Filed 1995·Granted Aug 5, 1997·62 cites·31 claims
- 1881US12255077B2Method for creating a wettable surface for improved reliability in QFN packagesTEXAS INSTRUMENTS INC·Filed 2023·Granted Mar 18, 2025·0 cites·14 claims
- 1980US8129224B2Stud bumps as local heat sinks during transient power operationsGURRUM SIVA P·Filed 2010·Granted Mar 6, 2012·7 cites·11 claims
- 2079US11128023B2Substrate design for efficient coupling between a package and a dielectric waveguideTEXAS INSTRUMENTS INC·Filed 2019·Granted Sep 21, 2021·3 cites·29 claims
- 2179US7572679B2Heat extraction from packaged semiconductor chips, scalable with chip areaTEXAS INSTRUMENTS INC·Filed 2007·Granted Aug 11, 2009·7 cites·16 claims
- 2279US2025218794A1Method for creating a wettable surface for improved reliability in qfn packagesTEXAS INSTRUMENTS INC·Filed 2025·Application pending·0 cites
- 2375US10559524B12-step die attach for reduced pedestal size of laminate component packagesTEXAS INSTRUMENTS INC·Filed 2018·Granted Feb 11, 2020·2 cites·30 claims
- 2474US10784188B2Methods and apparatus for a semiconductor device having bi-material die attach layerTEXAS INSTRUMENTS INC·Filed 2019·Granted Sep 22, 2020·1 cites·15 claims
- 2573US2023395969A1Wireless device with waveguiding structures between radiating structures and waveguide feedsTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 2672US10366944B2Methods and apparatus for semiconductor device having bi-material die attach layerTEXAS INSTRUMENTS INC·Filed 2018·Granted Jul 30, 2019·1 cites·15 claims
- 2772US2025174875A1Wireless device with waveguiding structures between radiating structures and waveguide feedsTEXAS INSTRUMENTS INC·Filed 2025·Application pending·0 cites
- 2871US11791168B2Method for creating a wettable surface for improved reliability in QFN packagesTEXAS INSTRUMENTS INC·Filed 2021·Granted Oct 17, 2023·0 cites·18 claims
- 2971US11735806B2Wireless device with waveguiding structures between radiating structures and waveguide feedsTEXAS INSTRUMENTS INC·Filed 2018·Granted Aug 22, 2023·1 cites·29 claims
- 3071US6137144AOn-chip ESD protection in dual voltage CMOSTEXAS INSTRUMENTS INC·Filed 1999·Granted Oct 24, 2000·27 cites·6 claims
- 3170US7040323B1Thin film intrauterine deviceTINI ALLOY CO·Filed 2003·Granted May 9, 2006·41 cites·2 claims
- 3267US10910705B2Antenna in package device having substrate stackTEXAS INSTRUMENTS INC·Filed 2019·Granted Feb 2, 2021·1 cites·20 claims
- 3367US8883567B2Process of making a stacked semiconductor package having a clipWYANT MICHAEL TODD·Filed 2012·Granted Nov 11, 2014·5 cites·17 claims
- 3466US11598742B2Semiconductor device for sensing impedance changes in a mediumTEXAS INSTRUMENTS INC·Filed 2020·Granted Mar 7, 2023·0 cites·19 claims
- 3565US8506767B2Thin-film shape memory alloy device and methodJOHNSON A DAVID·Filed 2011·Granted Aug 13, 2013·3 cites·20 claims
- 3663US6576961B1Substrate resistance ringTEXAS INSTRUMENTS INC·Filed 2002·Granted Jun 10, 2003·10 cites·42 claims
- 3761US11062982B2Packaged semiconductor device with a particle roughened surfaceTEXAS INSTRUMENTS INC·Filed 2019·Granted Jul 13, 2021·0 cites·20 claims
- 3861US8304897B2Thermal interface material design for enhanced thermal performance and improved package structural integrityGURRUM SIVA PRAKASH·Filed 2011·Granted Nov 6, 2012·1 cites·14 claims
- 3955US10883953B2Semiconductor device for sensing impedance changes in a mediumTEXAS INSTRUMENTS INC·Filed 2018·Granted Jan 5, 2021·0 cites·16 claims
- 4055US10186478B2Packaged semiconductor device with a particle roughened surfaceTEXAS INSTRUMENTS INC·Filed 2017·Granted Jan 22, 2019·0 cites·20 claims
- 4155US2024112978A1Electronic packageADVANCED SEMICONDUCTOR ENG·Filed 2022·Application pending·0 cites
- 4254US8110438B2Thermal method to control underfill flow in semiconductor devicesGUPTA VIKAS·Filed 2006·Granted Feb 7, 2012·1 cites·12 claims
- 4353US6433392B1Electrostatic discharge device and methodTEXAS INSTRUMENTS INC·Filed 1999·Granted Aug 13, 2002·12 cites·2 claims
- 4450US9780060B2Packaged IC with solderable sidewallsTEXAS INSTRUMENTS INC·Filed 2016·Granted Oct 3, 2017·0 cites·12 claims
- 4550US2022007669A1Method for making tea cubes using micronized tea and tea cubes made by the methodTATA CONSUMER PRODUCTS LTD·Filed 2020·Application pending·0 cites
- 4649US2017365575A1Packaged IC With Solderable SidewallsTEXAS INSTRUMENTS INC·Filed 2017·Application pending·0 cites
- 4749US2005159808A1Method for sputtering TiNi shape-memory alloysFiled 2004·Application pending·0 cites
- 4848US2008023805A1Array-Processed Stacked Semiconductor PackagesTEXAS INSTRUMENTS INC·Filed 2006·Application pending·0 cites
- 4948US2025001426A1Methodology for obtaining rollable and shelf stable pure millet flourTATA CONSUMER PRODUCTS LTD·Filed 2023·Application pending·0 cites
- 5048US2008251927A1Electromigration-Resistant Flip-Chip Solder JointsTEXAS INSTRUMENTS INC·Filed 2007·Application pending·0 cites
Showing the top 50 of 66 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →