Inventor · disambiguated record
Vinay Prabhakar
Also filed as: PRABHAKAR VINAY · PRABHAKAR VINAY K
31 granted patents·17 pending applications·52 citations·filing 2009–2024
94Inventor score
Top patents by PatentIndex Score
48 records- 0197US11670492B2Chamber configurations and processes for particle controlAPPLIED MATERIALS INC·Filed 2020·Granted Jun 6, 2023·5 cites·17 claims
- 0292US8172992B2Wafer electroplating apparatus for reducing edge defectsPRABHAKAR VINAY·Filed 2009·Granted May 8, 2012·21 cites·26 claims
- 0386US9543114B2Implant masking and alignment system with rollersINTEVAC INC·Filed 2015·Granted Jan 10, 2017·4 cites·16 claims
- 0486US9324598B2Substrate processing system and methodINTEVAC INC·Filed 2012·Granted Apr 26, 2016·7 cites·19 claims
- 0585US11584994B2Pedestal for substrate processing chambersAPPLIED MATERIALS INC·Filed 2019·Granted Feb 21, 2023·1 cites·21 claims
- 0682US10276364B2Bevel etch profile controlAPPLIED MATERIALS INC·Filed 2017·Granted Apr 30, 2019·3 cites·20 claims
- 0782US9875922B2Substrate processing system and methodINTEVAC INC·Filed 2016·Granted Jan 23, 2018·3 cites·16 claims
- 0882US9318332B2Grid for plasma ion implantINTEVAC INC·Filed 2013·Granted Apr 19, 2016·4 cites·22 claims
- 0980US12400843B2Chamber configurations and processes for particle controlAPPLIED MATERIALS INC·Filed 2023·Granted Aug 26, 2025·0 cites·19 claims
- 1080US12000048B2Pedestal for substrate processing chambersAPPLIED MATERIALS INC·Filed 2023·Granted Jun 4, 2024·0 cites·20 claims
- 1179US11600470B2Targeted heat control systemsAPPLIED MATERIALS INC·Filed 2019·Granted Mar 7, 2023·2 cites·20 claims
- 1276US12211728B2Electrostatic chuck design with improved chucking and arcing performanceAPPLIED MATERIALS INC·Filed 2023·Granted Jan 28, 2025·0 cites·20 claims
- 1375US2023151487A1Methods of reducing chamber residuesAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1474US11984305B2Substrate pedestal for improved substrate processingAPPLIED MATERIALS INC·Filed 2023·Granted May 14, 2024·0 cites·20 claims
- 1573US11515176B2Thermally controlled lid stack componentsAPPLIED MATERIALS INC·Filed 2020·Granted Nov 29, 2022·1 cites·20 claims
- 1673US2025022709A1Plasma-enhanced chemical vapor deposition of carbon hard-maskAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 1772US10629427B2Bevel etch profile controlAPPLIED MATERIALS INC·Filed 2019·Granted Apr 21, 2020·1 cites·20 claims
- 1871US2023170190A1Rf grounding configuration for pedestalsAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1968US11560623B2Methods of reducing chamber residuesAPPLIED MATERIALS INC·Filed 2020·Granted Jan 24, 2023·0 cites·16 claims
- 2062US11587773B2Substrate pedestal for improved substrate processingAPPLIED MATERIALS INC·Filed 2020·Granted Feb 21, 2023·0 cites·12 claims
- 2162US10923334B2Selective deposition of hardmaskAPPLIED MATERIALS INC·Filed 2019·Granted Feb 16, 2021·0 cites·23 claims
- 2261US11875969B2Process chamber with reduced plasma arcAPPLIED MATERIALS INC·Filed 2020·Granted Jan 16, 2024·0 cites·20 claims
- 2360US11682574B2Electrostatic chuck design with improved chucking and arcing performanceAPPLIED MATERIALS INC·Filed 2019·Granted Jun 20, 2023·0 cites·20 claims
- 2460US11569072B2RF grounding configuration for pedestalsAPPLIED MATERIALS INC·Filed 2019·Granted Jan 31, 2023·0 cites·19 claims
- 2558US12136549B2Plasma-enhanced chemical vapor deposition of carbon hard-maskAPPLIED MATERIALS INC·Filed 2019·Granted Nov 5, 2024·0 cites·20 claims
- 2658US11532463B2Semiconductor processing chamber and methods for cleaning the sameAPPLIED MATERIALS INC·Filed 2020·Granted Dec 20, 2022·0 cites·12 claims
- 2758US2025118593A1Processing chamber with rf return pathAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 2857US2012181170A1Wafer electroplating apparatus for reducing edge defectsPRABHAKAR VINAY·Filed 2012·Application pending·0 cites
- 2957US2024047185A1Shared rps clean and bypass delivery architectureAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 3057US2023265560A1Pumping liner and methods of manufacture and use thereofAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 3155US2019382889A1Technique to enable high temperature clean for rapid processing of wafersAPPLIED MATERIALS INC·Filed 2019·Application pending·0 cites
- 3253US2019378696A1Apparatus for suppressing parasitic plasma in plasma enhanced chemical vapor deposition chamberAPPLIED MATERIALS INC·Filed 2019·Application pending·0 cites
- 3352US11515129B2Radiation shield modification for improving substrate temperature uniformityAPPLIED MATERIALS INC·Filed 2019·Granted Nov 29, 2022·0 cites·20 claims
- 3450US11830706B2Heated pedestal design for improved heat transfer and temperature uniformityAPPLIED MATERIALS INC·Filed 2019·Granted Nov 28, 2023·0 cites·19 claims
- 3550US2024186121A1Thermal choke plateAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 3649US10599043B2Critical methodology in vacuum chambers to determine gap and leveling between wafer and hardware componentsAPPLIED MATERIALS INC·Filed 2017·Granted Mar 24, 2020·0 cites·20 claims
- 3749US9583661B2Grid for plasma ion implantINTEVAC INC·Filed 2016·Granted Feb 28, 2017·0 cites·20 claims
- 3848US2025118577A1Ceramic rf return kit designAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 3946US12266550B2Multiple process semiconductor processing systemAPPLIED MATERIALS INC·Filed 2020·Granted Apr 1, 2025·0 cites·12 claims
- 4046US10446430B2Patterned chuck for substrate processingINTEVAC INC·Filed 2017·Granted Oct 15, 2019·0 cites·18 claims
- 4146US2021066039A1Semiconductor processing apparatus with improved uniformityAPPLIED MATERIALS INC·Filed 2020·Application pending·0 cites
- 4245US12191115B2Dual RF for controllable film depositionAPPLIED MATERIALS INC·Filed 2019·Granted Jan 7, 2025·0 cites·15 claims
- 4345US2021287924A1Semiconductor substrate support with wafer backside damage controlAPPLIED MATERIALS INC·Filed 2020·Application pending·0 cites
- 4444US12424414B2Semiconductor processing system with a manifold for equal splitting and common divert architectureAPPLIED MATERIALS INC·Filed 2021·Granted Sep 23, 2025·0 cites·19 claims
- 4544US2021013069A1Multi-lid structure for semiconductor processing systemAPPLIED MATERIALS INC·Filed 2020·Application pending·0 cites
- 4641US2021082696A1Systems and methods of formation of a metal hardmask in device fabricationAPPLIED MATERIALS INC·Filed 2019·Application pending·0 cites
- 4741US2021025056A1Electrostatic chuck for damage-free substrate processingAPPLIED MATERIALS INC·Filed 2018·Application pending·0 cites
- 4841US2021017645A1Resolving spontaneous arcing during thick film deposition of high temperature amorphous carbon depositionAPPLIED MATERIALS INC·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →