Inventor · disambiguated record
Vidhya Ramachandran
Also filed as: RAMACHANDRAN VIDHYA
51 granted patents·22 pending applications·433 citations·filing 2001–2025
98Inventor score
Top patents by PatentIndex Score
73 records- 0197US9935076B1Structure and method for fabricating a computing system with an integrated voltage regulator moduleAPPLE INC·Filed 2016·Granted Apr 3, 2018·16 cites·10 claims
- 0297US7531407B2Semiconductor integrated circuit devices having high-Q wafer backside inductors and methods of fabricating sameIBM·Filed 2006·Granted May 12, 2009·61 cites·11 claims
- 0397US7276751B2Trench metal-insulator-metal (MIM) capacitors integrated with middle-of-line metal contacts, and method of fabricating sameIBM·Filed 2005·Granted Oct 2, 2007·50 cites·19 claims
- 0496US10756622B2Power management system switched capacitor voltage regulator with integrated passive deviceAPPLE INC·Filed 2018·Granted Aug 25, 2020·12 cites·22 claims
- 0595US9219032B2Integrating through substrate vias from wafer backside layers of integrated circuitsQUALCOMM INC·Filed 2013·Granted Dec 22, 2015·20 cites·10 claims
- 0694US9548288B1Integrated circuit die decoupling system with reduced inductanceAPPLE INC·Filed 2015·Granted Jan 17, 2017·17 cites·17 claims
- 0792US7682896B2Trench metal-insulator-metal (MIM) capacitors integrated with middle-of-line metal contacts, and method of fabricating sameIBM·Filed 2007·Granted Mar 23, 2010·20 cites·18 claims
- 0891US11158607B2Wafer reconstitution and die-stitchingAPPLE INC·Filed 2019·Granted Oct 26, 2021·4 cites·19 claims
- 0991US7473979B2Semiconductor integrated circuit devices having high-Q wafer back-side capacitorsIBM·Filed 2006·Granted Jan 6, 2009·18 cites·19 claims
- 1091US7388244B2Trench metal-insulator-metal (MIM) capacitors and method of fabricating sameIBM·Filed 2005·Granted Jun 17, 2008·21 cites·15 claims
- 1190US11735567B2Wafer reconstitution and die-stitchingAPPLE INC·Filed 2021·Granted Aug 22, 2023·1 cites·22 claims
- 1290US7851321B2Semiconductor integrated circuit devices having high-Q wafer back-side capacitorsIBM·Filed 2009·Granted Dec 14, 2010·16 cites·7 claims
- 1389US10818632B1Structure and method for fabricating a computing system with an integrated voltage regulator moduleAPPLE INC·Filed 2018·Granted Oct 27, 2020·3 cites·14 claims
- 1488US7160772B2Structure and method for integrating MIM capacitor in BEOL wiring levelsIBM·Filed 2005·Granted Jan 9, 2007·17 cites·8 claims
- 1586US8779559B2Structure and method for strain-relieved TSVRAMACHANDRAN VIDHYA·Filed 2012·Granted Jul 15, 2014·8 cites·9 claims
- 1686US7750388B2Trench metal-insulator metal (MIM) capacitorsIBM·Filed 2007·Granted Jul 6, 2010·12 cites·14 claims
- 1785US11967528B2Structure and method for fabricating a computing system with an integrated voltage regulator moduleAPPLE INC·Filed 2023·Granted Apr 23, 2024·0 cites·20 claims
- 1885US6876028B1Metal-insulator-metal capacitor and method of fabricationIBM·Filed 2003·Granted Apr 5, 2005·34 cites·19 claims
- 1983US12322730B2Wafer reconstitution and die-stitchingAPPLE INC·Filed 2023·Granted Jun 3, 2025·0 cites·13 claims
- 2083US11101732B2Power management system switched capacitor voltage regulator with integrated passive deviceAPPLE INC·Filed 2020·Granted Aug 24, 2021·1 cites·20 claims
- 2183US9748227B2Dual-sided silicon integrated passive devicesAPPLE INC·Filed 2016·Granted Aug 29, 2017·3 cites·11 claims
- 2281US8975729B2Integrating through substrate vias into middle-of-line layers of integrated circuitsQUALCOMM INC·Filed 2012·Granted Mar 10, 2015·5 cites·12 claims
- 2380US7397087B2FEOL/MEOL metal resistor for high end CMOSIBM·Filed 2004·Granted Jul 8, 2008·26 cites·8 claims
- 2480US2023299668A1Power management system switched capacitor voltage regulator with integrated passive deviceAPPLE INC·Filed 2023·Application pending·0 cites
- 2579US2025167048A1Structure and Method for Fabricating a Computing System with an Integrated Voltage Regulator ModuleAPPLE INC·Filed 2025·Application pending·0 cites
- 2678US9401353B2Interposer integrated with 3D passive devicesQUALCOMM INC·Filed 2014·Granted Jul 26, 2016·4 cites·20 claims
- 2778US9059263B2Low-K dielectric protection spacer for patterning through substrate vias through a low-K wiring layerRAMACHANDRAN VIDHYA·Filed 2012·Granted Jun 16, 2015·5 cites·19 claims
- 2878US2025158519A1Power management system switched capacitor voltage regulator with integrated passive deviceAPPLE INC·Filed 2025·Application pending·0 cites
- 2977US2025157991A1Wafer reconstitution and die-stitchingAPPLE INC·Filed 2025·Application pending·0 cites
- 3076US11699949B2Power management system switched capacitor voltage regulator with integrated passive deviceAPPLE INC·Filed 2021·Granted Jul 11, 2023·0 cites·16 claims
- 3176US11069665B2Trimmable banked capacitorAPPLE INC·Filed 2018·Granted Jul 20, 2021·2 cites·23 claims
- 3276US8952504B2Small form factor magnetic shield for magnetorestrictive random access memory (MRAM)QUALCOMM INC·Filed 2013·Granted Feb 10, 2015·3 cites·67 claims
- 3375US11670548B2Structure and method for fabricating a computing system with an integrated voltage regulator moduleAPPLE INC·Filed 2020·Granted Jun 6, 2023·0 cites·18 claims
- 3474US7888252B2Self-aligned contactIBM·Filed 2009·Granted Feb 15, 2011·4 cites·18 claims
- 3574US7687867B2Inexpensive method of fabricating a higher performance capacitance density MIMcap integrable into a copper interconnect schemeIBM·Filed 2007·Granted Mar 30, 2010·5 cites·11 claims
- 3673US12261132B2Structure and method for sealing a silicon ICAPPLE INC·Filed 2023·Granted Mar 25, 2025·0 cites·19 claims
- 3773US7282404B2Inexpensive method of fabricating a higher performance capacitance density MIMcap integrable into a copper interconnect schemeIBM·Filed 2004·Granted Oct 16, 2007·16 cites·11 claims
- 3868US11824015B2Structure and method for sealing a silicon ICAPPLE INC·Filed 2021·Granted Nov 21, 2023·0 cites·18 claims
- 3968US7825019B2Structures and methods for reduction of parasitic capacitances in semiconductor integrated circuitsIBM·Filed 2007·Granted Nov 2, 2010·4 cites·14 claims
- 4066US9379201B2Electrostatic discharge diodes and methods of forming electrostatic discharge diodesQUALCOMM INC·Filed 2015·Granted Jun 28, 2016·1 cites·16 claims
- 4165US9355904B2Method for strain-relieved through substrate viasQUALCOMM INC·Filed 2014·Granted May 31, 2016·1 cites·18 claims
- 4264US9093462B2Electrostatic discharge diodeQUALCOMM INC·Filed 2013·Granted Jul 28, 2015·1 cites·13 claims
- 4364US7301752B2Formation of metal-insulator-metal capacitor simultaneously with aluminum metal wiring level using a hardmaskIBM·Filed 2004·Granted Nov 27, 2007·10 cites·12 claims
- 4463US9502469B2Electrically reconfigurable interposer with built-in resistive memoryQUALCOMM INC·Filed 2014·Granted Nov 22, 2016·1 cites·17 claims
- 4563US7326987B2Non-continuous encapsulation layer for MIM capacitorIBM·Filed 2005·Granted Feb 5, 2008·2 cites·14 claims
- 4660US2025112154A1Power, Signaling and Thermal Path Co-optimizationAPPLE INC·Filed 2024·Application pending·0 cites
- 4760US2024421013A1Edge Recess Design for Molded and Fusion or Hybrid Bonded Integrated CircuitAPPLE INC·Filed 2024·Application pending·0 cites
- 4860US2024421126A1Chip Singulation Assisted Structures and Methods for Improving Bonding Interface QualityAPPLE INC·Filed 2024·Application pending·0 cites
- 4957US9276199B2Small form factor magnetic shield for magnetorestrictive random access memory (MRAM)QUALCOMM INC·Filed 2014·Granted Mar 1, 2016·0 cites·47 claims
- 5053US2025391664A1Plasma Dicing for Multi-Tier Die for Die Strength Enhancement and Irregular Shaped DicingAPPLE INC·Filed 2025·Application pending·0 cites
Showing the top 50 of 73 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →