Inventor · disambiguated record
Vijay Sukumaran
Also filed as: SUKUMARAN VIJAY
6 granted patents·1 pending application·71 citations·filing 2011–2017
81Inventor score
Top patents by PatentIndex Score
7 records- 0192US9805977B1Integrated circuit structure having through-silicon via and method of forming sameGLOBALFOUNDRIES INC·Filed 2016·Granted Oct 31, 2017·16 cites·20 claims
- 0292US9275934B2Through-package-via (TPV) structures on inorganic interposer and methods for fabricating sameSUNDARAM VENKATESH·Filed 2011·Granted Mar 1, 2016·43 cites·17 claims
- 0388US10672718B2Through-package-via (TPV) structures on inorganic interposer and methods for fabricating sameGEORGIA TECH RES INST·Filed 2016·Granted Jun 2, 2020·6 cites·18 claims
- 0487US10090255B2Dicing channels for glass interposersGLOBALFOUNDRIES INC·Filed 2016·Granted Oct 2, 2018·6 cites·20 claims
- 0546US10325808B2Crack prevent and stop for thin glass substratesGLOBALFOUNDRIES INC·Filed 2017·Granted Jun 18, 2019·0 cites·20 claims
- 0643US9892971B1Crack prevent and stop for thin glass substratesGLOBALFOUNDRIES INC·Filed 2016·Granted Feb 13, 2018·0 cites·11 claims
- 0731US2018254239A1FORMING METAL CAP LAYER OVER THROUGH-GLASS-VIAS (TGVs)GLOBALFOUNDRIES INC·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →