Inventor · disambiguated record
Vikram Shreeshail Turkani
Also filed as: TURKANI VIKRAM S · TURKANI VIKRAM SHREESHAIL
2 granted patents·8 pending applications·8 citations·filing 2020–2025
55Inventor score
Top patents by PatentIndex Score
10 records- 0193US11358381B1Method for attaching and detaching substrates during integrated circuit manufacturingNCC NANO LLC·Filed 2021·Granted Jun 14, 2022·6 cites·16 claims
- 0284US11996384B2Method and apparatus for debonding temporarily bonded wafers in wafer-level packaging applicationsNCC NANO LLC·Filed 2020·Granted May 28, 2024·2 cites·5 claims
- 0371US2025022838A1Method and apparatus for debonding temporarily bonded wafers in wafer-level packaging applicationsPULSEFORGE INC·Filed 2024·Application pending·0 cites
- 0468US2025282979A1Photonic debonding for wafer-level packaging applicationsBREWER SCIENCE INC·Filed 2025·Application pending·0 cites
- 0558US2024384045A1Method for curing and releasing thermosetting polymers on a coated glass substratePULSEFORGE INC·Filed 2023·Application pending·0 cites
- 0652US2024213400A1Method for integrating semiconductor chips on a substrateTURKANI VIKRAM SHREESHAIL·Filed 2022·Application pending·0 cites
- 0749US2025358905A1Method and apparatus for thermal processing using pulsed resistance heatingPULSEFORGE INC·Filed 2025·Application pending·0 cites
- 0845US2025289215A1Method for attaching and detaching wafers during integrated circuit manufacturingPULSEFORGE INC·Filed 2024·Application pending·0 cites
- 0943US2025323207A1Method for bonding electronics structures during integrated electronics manufacturingPULSEFORGE INC·Filed 2025·Application pending·0 cites
- 1042US2022306177A1Method for attaching and detaching substrates during integrated circuit manufacturingPULSEFORGE INC·Filed 2022·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Vikram Shreeshail Turkani files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →