Inventor · disambiguated record
W. Boyd Rogers
Also filed as: ROGERS W BOYD
2 granted patents·425 citations·filing 1996–1998
73Inventor score
Technology areasH10W
Files withMCNC2
Top patents by PatentIndex Score
2 records- 0196US5767010ASolder bump fabrication methods and structure including a titanium barrier layerMCNC·Filed 1996·Granted Jun 16, 1998·322 cites·35 claims
- 0289US6222279B1Solder bump fabrication methods and structures including a titanium barrier layerMCNC·Filed 1998·Granted Apr 24, 2001·103 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →