Inventor · disambiguated record
Wai Chan
Also filed as: CHAN WAI · CHAN WAI SING JONATHAN
5 granted patents·45 citations·filing 2003–2020
77Inventor score
Top patents by PatentIndex Score
5 records- 0166US7125750B2Leadframe with enhanced encapsulation adhesionASM ASSEMBLY MATERIALS LTD·Filed 2004·Granted Oct 24, 2006·17 cites·19 claims
- 0265US6886253B2Foil cutterFiled 2003·Granted May 3, 2005·13 cites·20 claims
- 0363US7329617B2Coating for enhancing adhesion of molding compound to semiconductor devicesASM ASSEMBLY AUTOMATION LTD·Filed 2004·Granted Feb 12, 2008·14 cites·21 claims
- 0438US8012886B2Leadframe treatment for enhancing adhesion of encapsulant theretoASM ASSEMBLY MATERIALS LTD·Filed 2007·Granted Sep 6, 2011·0 cites·16 claims
- 0537USD1038711SCitrus reamer deviceCINNABAR CREATIONS INC·Filed 2020·Granted Aug 13, 2024·1 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →