Inventor · disambiguated record
Wakana Onoe
Also filed as: ONOE WAKANA
6 granted patents·2 pending applications·5 citations·filing 2013–2019
70Inventor score
Files withDISCO CORP8
Top patents by PatentIndex Score
8 records- 0174US10784166B2Wafer processing methodDISCO CORP·Filed 2019·Granted Sep 22, 2020·2 cites·4 claims
- 0270US10722980B2Laser processing apparatusDISCO CORP·Filed 2016·Granted Jul 28, 2020·2 cites·9 claims
- 0361US9434023B2Laser machining apparatusDISCO CORP·Filed 2014·Granted Sep 6, 2016·1 cites·1 claims
- 0443US10991622B2Wafer processing methodDISCO CORP·Filed 2019·Granted Apr 27, 2021·0 cites·7 claims
- 0541US10991623B2Wafer processing methodDISCO CORP·Filed 2019·Granted Apr 27, 2021·0 cites·3 claims
- 0640US2014106543A1Laser processing method for waferDISCO CORP·Filed 2013·Application pending·0 cites
- 0735US10695870B2Laser processing apparatusDISCO CORP·Filed 2018·Granted Jun 30, 2020·0 cites·8 claims
- 0831US2017087663A1Laser processing apparatusDISCO CORP·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →