Inventor · disambiguated record
Wang-Hsiang Tsai
Also filed as: TSAI WANG-HSIANG
4 granted patents·3 pending applications·34 citations·filing 2007–2021
68Inventor score
Top patents by PatentIndex Score
7 records- 0190US7968991B2Stacked package module and board having exposed endsUNIMICRON TECHNOLOGY CORP·Filed 2007·Granted Jun 28, 2011·32 cites·16 claims
- 0274US11127664B2Circuit board and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2016·Granted Sep 21, 2021·2 cites·10 claims
- 0359US11895780B2Manufacturing method of package structureUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Feb 6, 2024·0 cites·5 claims
- 0448US11477886B2Circuit board structure and spliced circuit boardUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Oct 18, 2022·0 cites·20 claims
- 0547US2017374748A1Package structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2017·Application pending·0 cites
- 0644US2020068721A1Package structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2019·Application pending·0 cites
- 0741US2008230886A1Stacked package modulePHOENIX PREC TECHNOLOGY CORP·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →