Inventor · disambiguated record
Wan Yin Yau
Also filed as: YAU WAN YIN
6 granted patents·2 pending applications·1 citations·filing 2011–2023
65Inventor score
Top patents by PatentIndex Score
8 records- 0158US10882298B2System for adjusting relative positions between components of a bonding apparatusASM TECH SINGAPORE PTE LTD·Filed 2016·Granted Jan 5, 2021·1 cites·15 claims
- 0250US2025031357A1Bonding tool incorporating decoupled motion axesASMPT SINGAPORE PTE LTD·Filed 2023·Application pending·0 cites
- 0343US11600516B2Die ejector height adjustmentASMPT SINGAPORE PTE LTD·Filed 2020·Granted Mar 7, 2023·0 cites·15 claims
- 0442US11343949B2Apparatus and method for dispensing a viscous adhesiveASM TECH SINGAPORE PTE LTD·Filed 2018·Granted May 24, 2022·0 cites·12 claims
- 0541US11289445B2Die bonder incorporating rotatable adhesive dispenser headASM TECH SINGAPORE PTE LTD·Filed 2018·Granted Mar 29, 2022·0 cites·16 claims
- 0635US10096568B2Die bonding tool and systemCHEUNG KWOK YUEN·Filed 2014·Granted Oct 9, 2018·0 cites·17 claims
- 0734US10050008B1Method and system for automatic bond arm alignmentASM TECH SINGAPORE PTE LTD·Filed 2017·Granted Aug 14, 2018·0 cites·11 claims
- 0831US2013011941A1Bond line thickness control for die attachmentASM TECH SINGAPORE PTE LTD·Filed 2011·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Wan Yin Yau files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →