Inventor · disambiguated record
Wenxu Cao
Also filed as: CAO WENXU
0 granted patents·2 pending applications·0 citations·filing 2021–2021
Technology areasG06F
Top patents by PatentIndex Score
2 records- 0127US2022276306A1Communication method and its system between interconnected die and dsp/fpga58TH RESEARCH INSTITUTE OF CHINA ELECTRONICS TECH GROUP CORPORATION·Filed 2021·Application pending·0 cites
- 0227US2022276982A1Interconnected Dies, Interconnected Microcomponents, Interconnected Microsystems and Their Communication Methods58TH RESEARCH INSTITUTE OF CHINA ELECTRONICS TECH GROUP CORPORATION·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →