Inventor · disambiguated record
Wei-Che Chang
Also filed as: CHANG WEI · CHANG WEI-CHE
35 granted patents·16 pending applications·82 citations·filing 2005–2025
95Inventor score
Files withWINBOND ELECTRONICS CORP27INNOVATIVE SONIC CORP4CHROMA ATE INC3CHANG WEI-CHE2SILICONWARE PRECISION INDUSTRIES CO LTD2
Top patents by PatentIndex Score
51 records- 0196US9972626B1Dynamic random access memory and method of fabricating the sameWINBOND ELECTRONICS CORP·Filed 2017·Granted May 15, 2018·23 cites·5 claims
- 0294US10083906B1Memory device with buried word line for reduced gate-induced drain leakage current and method for manufacturing the sameWINBOND ELECTRONICS CORP·Filed 2018·Granted Sep 25, 2018·11 cites·20 claims
- 0389US9613967B1Memory device and method of fabricating the sameWINBOND ELECTRONICS CORP·Filed 2016·Granted Apr 4, 2017·9 cites·19 claims
- 0482US10074654B1Dynamic random access memoryWINBOND ELECTRONICS CORP·Filed 2018·Granted Sep 11, 2018·3 cites·10 claims
- 0580US10910380B2Method of manufacturing dynamic random access memoryWINBOND ELECTRONICS CORP·Filed 2019·Granted Feb 2, 2021·2 cites·14 claims
- 0680US8099045B2Near field communication system and associated apparatusCHANG WEI·Filed 2008·Granted Jan 17, 2012·9 cites·15 claims
- 0780US7580590B2Optical image system surface resolution calibration methodCHROMA ATE INC·Filed 2006·Granted Aug 25, 2009·16 cites·6 claims
- 0879US10797057B2DRAM semiconductor device having reduced parasitic capacitance between capacitor contacts and bit line structures and method for manufacturing the sameWINBOND ELECTRONICS CORP·Filed 2018·Granted Oct 6, 2020·2 cites·14 claims
- 0976US2025098156A1Method for forming semiconductor structureWINBOND ELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1072US10424586B2Memory device including a trench isolation structure between buried word lines and manufacturing method thereofWINBOND ELECTRONICS CORP·Filed 2018·Granted Sep 24, 2019·2 cites·18 claims
- 1171US2025233075A1Method of forming semiconductor structureWINBOND ELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 1270US12300612B2Semiconductor structure including conductive layers contacting trenchWINBOND ELECTRONICS CORP·Filed 2022·Granted May 13, 2025·0 cites·15 claims
- 1370US11765888B2Methods of manufacturing dynamic random access memoryWINBOND ELECTRONICS CORP·Filed 2021·Granted Sep 19, 2023·0 cites·7 claims
- 1470US11183499B2Dynamic random access memory and methods of manufacturing, writing and reading the sameWINBOND ELECTRONICS CORP·Filed 2018·Granted Nov 23, 2021·2 cites·8 claims
- 1570US10332572B2Memory device and manufacturing method thereofWINBOND ELECTRONICS CORP·Filed 2018·Granted Jun 25, 2019·1 cites·16 claims
- 1669US12089394B2Semiconductor structureWINBOND ELECTRONICS CORP·Filed 2022·Granted Sep 10, 2024·0 cites·9 claims
- 1767US12193221B2Semiconductor structure and method for forming the sameWINBOND ELECTRONICS CORP·Filed 2021·Granted Jan 7, 2025·0 cites·10 claims
- 1865US11495605B2Semiconductor structure and manufacturing method thereofWINBOND ELECTRONICS CORP·Filed 2020·Granted Nov 8, 2022·0 cites·9 claims
- 1964US11404422B2DRAM semiconductor device having reduced parasitic capacitance between capacitor contacts and bit line structures and method for manufacturing the sameWINBOND ELECTRONICS CORP·Filed 2020·Granted Aug 2, 2022·0 cites·13 claims
- 2063US11545493B2Memory devices and methods of fabricating the sameWINBOND ELECTRONICS CORP·Filed 2020·Granted Jan 3, 2023·0 cites·8 claims
- 2161US11815970B2Enabling system boot-up in low temperature environmentsDELL PRODUCTS LP·Filed 2022·Granted Nov 14, 2023·0 cites·19 claims
- 2260US2024057316A1Buried gate structure for dynamic random access memory and method for forming the sameWINBOND ELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 2358US8956961B2Semiconductor device and method for making the sameTAKESAKO KAZUAKI·Filed 2012·Granted Feb 17, 2015·2 cites·14 claims
- 2458US2025311198A1Memory device and method of fabricating the sameWINBOND ELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 2557US10910384B2Memory devices and methods of fabricating the sameWINBOND ELECTRONICS CORP·Filed 2019·Granted Feb 2, 2021·0 cites·10 claims
- 2656US12394675B2Method and system for monitoring and controlling semiconductor processWINBOND ELECTRONICS CORP·Filed 2022·Granted Aug 19, 2025·0 cites·10 claims
- 2754US2025024383A1Frequency band power limit reporting in a user equipmentQUALCOMM INC·Filed 2023·Application pending·0 cites
- 2853US12101943B2Semiconductor structure and fabrication method thereofCHANGXIN MEMORY TECH INC·Filed 2022·Granted Sep 24, 2024·0 cites·19 claims
- 2953US12029049B2Memory structures and methods for forming the sameWINBOND ELECTRONICS CORP·Filed 2020·Granted Jul 2, 2024·0 cites·20 claims
- 3052US11690214B2Dynamic random access memory and method for manufacturing the sameWINBOND ELECTRONICS CORP·Filed 2021·Granted Jun 27, 2023·0 cites·20 claims
- 3152US9899314B2Semiconductor substrate and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Feb 20, 2018·0 cites·3 claims
- 3251US11335770B2Semiconductor isolation structures having different configurations in different device regions and method of forming the sameWINBOND ELECTRONICS CORP·Filed 2020·Granted May 17, 2022·0 cites·12 claims
- 3351US10403573B2Fabrication method of semiconductor substrateSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2018·Granted Sep 3, 2019·0 cites·6 claims
- 3451US2019019795A1Dynamic random access memory and method of manufacturing the sameWINBOND ELECTRONICS CORP·Filed 2018·Application pending·0 cites
- 3547US2009116667A1Method and Apparatus for Volume AdjustmentAVERMEDIA TECH INC·Filed 2007·Application pending·0 cites
- 3647US2015334735A1Method and apparatus for supporting for device-to-device (d2d) communication in a wireless communication systemINNOVATIVE SONIC CORP·Filed 2015·Application pending·0 cites
- 3746US10366995B2Semiconductor structure and manufacturing method thereofWINBOND ELECTRONICS CORP·Filed 2018·Granted Jul 30, 2019·0 cites·20 claims
- 3846US2015334715A1Method and apparatus for supporting for device-to-device (d2d) services in a wireless communication systemINNOVATIVE SONIC CORP·Filed 2015·Application pending·0 cites
- 3944US11839490B2Three wavelength pulse oximetryGARMIN INT INC·Filed 2020·Granted Dec 12, 2023·0 cites·18 claims
- 4044US11064390B2Traffic control method and device, terminal, system, and storage mediumZTE CORP·Filed 2017·Granted Jul 13, 2021·0 cites·17 claims
- 4141US11558111B2Satellite network communication with proxy service apparatus for acquiring targeted resourcesZTE CORP·Filed 2018·Granted Jan 17, 2023·0 cites·18 claims
- 4239US11320809B2Factory management system and control systemGRADE UPON TECH CORPORATION·Filed 2020·Granted May 3, 2022·0 cites·23 claims
- 4335US2016073382A1Method and apparatus for improving downlink control information (dci) in a wireless communication systemASUSTEK COMP INC·Filed 2015·Application pending·0 cites
- 4435US2016014834A1Method and apparatus for implementing device-to-device (d2d) service power control in a wireless communication systemINNOVATIVE SONIC CORP·Filed 2015·Application pending·0 cites
- 4534US2017201819A1Wearable electronic deviceALTEK CORP·Filed 2016·Application pending·0 cites
- 4633US7423764B2Integrated interference scanning methodCHROMA ATE INC·Filed 2006·Granted Sep 9, 2008·0 cites·8 claims
- 4733US2012254387A1Method and system for managing controllersCHANG WEI-CHE·Filed 2011·Application pending·0 cites
- 4833US2007127036A1Interference measurement system self-alignment methodCHROMA ATE INC·Filed 2005·Application pending·0 cites
- 4933US2015245334A1Method and apparatus for device to device service in a wireless communication systemINNOVATIVE SONIC CORP·Filed 2015·Application pending·0 cites
- 5031US2013193511A1Vertical transistor structureFANG HSUAN-YU·Filed 2012·Application pending·0 cites
Showing the top 50 of 51 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →