Inventor · disambiguated record
Weng-Yi Chen
Also filed as: CHEN WENG-YI
22 granted patents·5 pending applications·52 citations·filing 1998–2024
93Inventor score
Files withUNITED MICROELECTRONICS CORP21UNITED INTEGRATED CIRCUITS CORP4UNITED INTEGRATED CIRCUIT CORP1UTEK SEMICONDUCTOR CORP1
Top patents by PatentIndex Score
27 records- 0188US12103845B2Micro-electromechanical system and method for fabricating MEMS having protection wallUNITED MICROELECTRONICS CORP·Filed 2020·Granted Oct 1, 2024·2 cites·20 claims
- 0287US10640368B2Semiconductor sensor and method of manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2016·Granted May 5, 2020·5 cites·13 claims
- 0383US10737932B2Micro-electro-mechanical system structure and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2019·Granted Aug 11, 2020·2 cites·18 claims
- 0481US9961450B2Piezoresistive microphone and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2016·Granted May 1, 2018·3 cites·19 claims
- 0578US12441606B2MEMS device including coil structure with corrugated polymer filmUNITED MICROELECTRONICS CORP·Filed 2022·Granted Oct 14, 2025·0 cites·8 claims
- 0674US9950920B2Micro-electro-mechanical system structure and method for forming the sameUNITED MICROELECTRONICS CORP·Filed 2016·Granted Apr 24, 2018·2 cites·11 claims
- 0774US2024425366A1Micro-electromechanical system and method for fabricating mems having protection wallUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 0872US10112825B2Semiconductor structure and manufacturing method for the sameUNITED MICROELECTRONICS CORP·Filed 2017·Granted Oct 30, 2018·1 cites·14 claims
- 0967US11345590B2Semiconductor sensor and method of manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2020·Granted May 31, 2022·0 cites·9 claims
- 1067US6207498B1Method of fabricating a coronary-type capacitor in an integrated circuitUNITED INTEGRATED CIRCUITS CORP·Filed 2000·Granted Mar 27, 2001·15 cites·21 claims
- 1165US10870576B2Semiconductor sensor and method of manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2020·Granted Dec 22, 2020·0 cites·10 claims
- 1263US10115582B2Semiconductor device and method for manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2015·Granted Oct 30, 2018·1 cites·6 claims
- 1361US10427935B2Manufacturing method for semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2018·Granted Oct 1, 2019·0 cites·5 claims
- 1461US2025313455A1Microelectromechanical systems device and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1554US10773953B2MEMS structure and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2017·Granted Sep 15, 2020·0 cites·10 claims
- 1654US10475640B2Method for manufacturing semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2018·Granted Nov 12, 2019·0 cites·4 claims
- 1754US10457546B2Micro-electro-mechanical system structure and method for forming the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted Oct 29, 2019·0 cites·9 claims
- 1854US2023406692A1Microelectromechanical system (mems) microphone and fabrication method thereofUNITED MICROELECTRONICS CORP·Filed 2022·Application pending·0 cites
- 1951US9790088B2MEMS structure and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2016·Granted Oct 17, 2017·0 cites·9 claims
- 2044US2009321870A1Shuttle wafer and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2008·Application pending·0 cites
- 2139US6051464AMethod for fabricating a capacitor of a DRAM with an HSG layerUNITED INTEGRATED CIRCUITS CORP·Filed 1998·Granted Apr 18, 2000·7 cites·25 claims
- 2238US6077761AMethod for fabricating a transistor gate with a T-like structureUNITED INTEGRATED CIRCUIT CORP·Filed 1998·Granted Jun 20, 2000·7 cites·24 claims
- 2335US2018339901A1Semiconductor processUNITED MICROELECTRONICS CORP·Filed 2017·Application pending·0 cites
- 2431US6221747B1Method of fabricating a conductive plug with a low junction resistance in an integrated circuitUNITED INTEGRATED CIRCUITS CORP·Filed 1999·Granted Apr 24, 2001·4 cites·13 claims
- 2529US6129950AMethod of forming a thick polysilicon layerUNITED MICROELECTRONICS CORP·Filed 1998·Granted Oct 10, 2000·1 cites·11 claims
- 2629US6121114AMethod for preparing a dummy waferUNITED INTEGRATED CIRCUITS CORP·Filed 1998·Granted Sep 19, 2000·1 cites·10 claims
- 2724US6315834B1Method for removing extraneous matter by using fluorine-containing solutionUTEK SEMICONDUCTOR CORP·Filed 1999·Granted Nov 13, 2001·1 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →