Inventor · disambiguated record
Wen-Chih Chiou
Also filed as: CHIOU WEN-CHIH
358 granted patents·74 pending applications·7,313 citations·filing 1994–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD231TAIWAN SEMICONDUCTOR MFG88YU CHEN-HUA28CHEN DING-YUAN12CHIOU WEN-CHIH11
Top patents by PatentIndex Score
432 records- 0199US11502072B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 15, 2022·7 cites·19 claims
- 0299US9263511B2Package with metal-insulator-metal capacitor and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Feb 16, 2016·1k cites·20 claims
- 0399US8802504B13D packages and methods for forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Aug 12, 2014·408 cites·20 claims
- 0499US8669174B2Multi-die stacking using bumps with different sizesTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Mar 11, 2014·139 cites·20 claims
- 0599US7385283B2Three dimensional integrated circuit and method of making the sameTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Jun 10, 2008·279 cites·22 claims
- 0698US11728254B2Giga interposer integration through chip-on-wafer-on-substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 15, 2023·11 cites·20 claims
- 0798US11469197B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 11, 2022·4 cites·20 claims
- 0898US11145623B2Integrated circuit packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 12, 2021·23 cites·20 claims
- 0998US10797031B2Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 6, 2020·45 cites·20 claims
- 1098US10373885B23D stacked-chip packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 6, 2019·49 cites·20 claims
- 1198US10333623B1Optical transceiverTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 25, 2019·91 cites·20 claims
- 1298US9425126B2Dummy structure for chip-on-wafer-on-substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Aug 23, 2016·883 cites·20 claims
- 1398US9281254B2Methods of forming integrated circuit packageTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Mar 8, 2016·1.8k cites·20 claims
- 1498US8803316B2TSV structures and methods for forming the sameLIN YUNG-CHI·Filed 2011·Granted Aug 12, 2014·381 cites·20 claims
- 1598US8426961B2Embedded 3D interposer structureSHIH YING-CHING·Filed 2010·Granted Apr 23, 2013·188 cites·21 claims
- 1698US8105875B1Approach for bonding dies onto interposersHU HSIEN-PIN·Filed 2010·Granted Jan 31, 2012·192 cites·13 claims
- 1797US11961800B2Via for semiconductor device connection and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 16, 2024·2 cites·20 claims
- 1897US11855021B2Semiconductor structure with through substrate vias and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·3 cites·20 claims
- 1997US11610866B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 21, 2023·3 cites·20 claims
- 2097US11594420B1Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 28, 2023·3 cites·20 claims
- 2197US11487060B2Semiconductor device with nanostructures aligned with grating coupler and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 1, 2022·5 cites·20 claims
- 2297US9748190B2Low cost and ultra-thin chip on wafer on substrate (CoWoS) formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 29, 2017·25 cites·21 claims
- 2397US8900994B2Method for producing a protective structureYU CHEN-HUA·Filed 2011·Granted Dec 2, 2014·25 cites·20 claims
- 2497US8791549B2Wafer backside interconnect structure connected to TSVsCHEN MING-FA·Filed 2010·Granted Jul 29, 2014·29 cites·19 claims
- 2597US8674513B2Interconnect structures for substrateYU CHEN-HUA·Filed 2010·Granted Mar 18, 2014·36 cites·17 claims
- 2697US8629465B2Light-emitting diodes on concave texture substrateYU CHEN-HUA·Filed 2012·Granted Jan 14, 2014·16 cites·19 claims
- 2796US12015008B2Wafer bonding methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 18, 2024·2 cites·20 claims
- 2896US11855067B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·2 cites·20 claims
- 2996US9893028B2Bond structures and the methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Feb 13, 2018·13 cites·20 claims
- 3096US9773768B2Method and structure of three-dimensional chip stackingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Sep 26, 2017·12 cites·20 claims
- 3196US9666520B23D stacked-chip packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted May 30, 2017·26 cites·19 claims
- 3296US8053900B2Through-substrate vias (TSVs) electrically connected to a bond pad design with reduced dishing effectTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted Nov 8, 2011·42 cites·12 claims
- 3396US7939941B2Formation of through via before contact processingTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted May 10, 2011·36 cites·13 claims
- 3495US11817361B2Passivation structure with planar top surfacesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 14, 2023·2 cites·20 claims
- 3595US11774675B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 3, 2023·2 cites·20 claims
- 3695US11728314B2Methods of forming integrated circuit packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 15, 2023·2 cites·20 claims
- 3795US10157892B1Semiconductor packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 18, 2018·11 cites·20 claims
- 3895US9978708B2Wafer backside interconnect structure connected to TSVsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 22, 2018·9 cites·20 claims
- 3995US9048231B23D packages and methods for forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jun 2, 2015·13 cites·20 claims
- 4095US8928159B2Alignment marks in substrate having through-substrate via (TSV)CHANG HSIN·Filed 2010·Granted Jan 6, 2015·29 cites·20 claims
- 4195US8513119B2Method of forming bump structure having tapered sidewalls for stacked diesCHANG HUNG-PIN·Filed 2008·Granted Aug 20, 2013·35 cites·12 claims
- 4295US8264077B2Backside metal of redistribution line with silicide layer on through-silicon via of semiconductor chipsCHIOU WEN-CHIH·Filed 2008·Granted Sep 11, 2012·36 cites·16 claims
- 4395US8058082B2Light-emitting diode with textured substrateYU CHEN-HUA·Filed 2008·Granted Nov 15, 2011·28 cites·19 claims
- 4495US7883991B1Temporary carrier bonding and detaching processesTAIWAN SEMICONDUCTOR MFG·Filed 2010·Granted Feb 8, 2011·123 cites·20 claims
- 4595US6398627B1Slurry dispenser having multiple adjustable nozzlesTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Jun 4, 2002·57 cites·20 claims
- 4694US10854574B2Forming metal bonds with recessesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 1, 2020·9 cites·19 claims
- 4794US10510718B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 17, 2019·8 cites·20 claims
- 4894US8581418B2Multi-die stacking using bumps with different sizesWU WENG-JIN·Filed 2010·Granted Nov 12, 2013·17 cites·20 claims
- 4994US8119500B2Wafer bondingYANG KU-FENG·Filed 2007·Granted Feb 21, 2012·29 cites·18 claims
- 5094US8053277B2Three-dimensional integrated circuits with protection layersTAIWAN SEMICONDUCTOR MFG·Filed 2010·Granted Nov 8, 2011·27 cites·19 claims
Showing the top 50 of 432 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →