Inventor · disambiguated record
Weibing Chu
Also filed as: CHU WEIBING
0 granted patents·5 pending applications·0 citations·filing 2012–2012
Technology areasH10W
Top patents by PatentIndex Score
5 records- 0139US2013017652A1Method of manufacturing a semiconductor device package with a heatsinkGEM SERVICES INC·Filed 2012·Application pending·0 cites
- 0239US2013009297A1Semiconductor device package having configurable lead frame fingersGEM SERVICES INC·Filed 2012·Application pending·0 cites
- 0339US2013009296A1Semiconductor device package having features formed by stampingGEM SERVICES INC·Filed 2012·Application pending·0 cites
- 0434US2012181677A1Semiconductor device package with two component lead frameTSUI ANTHONY C·Filed 2012·Application pending·0 cites
- 0534US2012181676A1Power semiconductor device packagingTSUI ANTHONY C·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →