Inventor · disambiguated record
Wentao Dan
Also filed as: DAN WENTAO
1 granted patent·2 pending applications·0 citations·filing 2018–2019
11Inventor score
Top patents by PatentIndex Score
3 records- 0140US10967481B2CMP layer based on porous cerium oxide and preparation method thereofHUBEI DINGHUI MICROELECTRONICS MAT CO LTD·Filed 2018·Granted Apr 6, 2021·0 cites·3 claims
- 0238US2019105753A1CMP composite groove polishing padCHENGDU TIMES LIVE SCIENCE AND TECH CO LTD·Filed 2018·Application pending·0 cites
- 0326US2019232458A1CMP groove processing positioning method and positioning deviceCHENGDU TIMES LIVE SCIENCE AND TECH CO LTD·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →