CMP composite groove polishing pad

Abstract

A CMP (chemical mechanical polishing) composite groove polishing pad includes a polishing pad substrate and has a rotation center located in a middle of the polishing pad substrate, a first groove, a second groove and a third groove; the first groove and the second groove are communicated with each other end to end to form a petal-shaped composite groove. The first groove includes at least two positive spiral logarithmic sub grooves each of which is a semicircular curve radially distributed along the polishing pad substrate, starts from the rotation center and ends with an edge of the polishing pad substrate. The second groove includes at least two negative spiral logarithmic sub grooves each of which is a reverse semicircular curve radially distributed along the polishing pad substrate, starts from the rotation center and ends with the edge of the polishing pad substrate.

What is claimed is: 
     
         1 . A CMP (chemical mechanical polishing) composite groove polishing pad comprising a polishing pad substrate ( 1 ) and having a rotation center ( 101 ) located in a middle of the polishing pad substrate ( 1 ), a first groove ( 2 ), a second groove ( 3 ) and a third groove ( 4 ), wherein all of the first groove ( 2 ), the second groove ( 3 ) and the third groove ( 4 ) are provided on the polishing pad substrate ( 1 ); the first groove ( 2 ) and the second groove ( 3 ) are communicated with each other end to end to form a petal-shaped composite groove. 
     
     
         2 . The CMP composite groove polishing pad, as recited in  claim 1 , wherein: the first groove ( 2 ) comprises at least two positive spiral logarithmic sub grooves ( 201 ) each of which is a forward semicircular curve radially distributed along the polishing pad substrate ( 1 ), starts from the rotation center ( 101 ) and ends with an edge of the polishing pad substrate ( 1 ). 
     
     
         3 . The CMP composite groove polishing pad, as recited in  claim 2 , wherein: the first groove ( 2 ) comprises two to eight positive spiral logarithmic sub grooves. 
     
     
         4 . The CMP composite groove polishing pad, as recited in  claim 1 , wherein: the second groove ( 3 ) comprises at least two negative spiral logarithmic sub grooves ( 202 ) each of which is a reverse semicircular curve radially distributed along the polishing pad substrate ( 1 ), starts from the rotation center ( 101 ) and ends with the edge of the polishing pad substrate ( 1 ). 
     
     
         5 . The CMP composite groove polishing pad, as recited in  claim 4 , wherein: the second groove ( 3 ) comprises two to eight negative spiral logarithmic sub grooves. 
     
     
         6 . The CMP composite groove polishing pad, as recited in  claim 1 , wherein: an angle in a range of 0-150 degrees is formed at a junction of the third groove ( 4 ) and each of the positive spiral logarithmic sub grooves of the first groove ( 2 ), and an angle in a range of 0-150 degrees is formed at a junction of the third groove ( 4 ) and each of the negative spiral logarithmic sub grooves of the second groove ( 3 ). 
     
     
         7 . The CMP composite groove polishing pad, as recited in  claim 2 , wherein: an angle in a range of 0-150 degrees is formed at a junction of the third groove ( 4 ) and each of the positive spiral logarithmic sub grooves of the first groove ( 2 ), and an angle in a range of 0-150 degrees is formed at a junction of the third groove ( 4 ) and each of the negative spiral logarithmic sub grooves of the second groove ( 3 ). 
     
     
         8 . The CMP composite groove polishing pad, as recited in  claim 4 , wherein: an angle in a range of 0-150 degrees is formed at a junction of the third groove ( 4 ) and each of the positive spiral logarithmic sub grooves of the first groove ( 2 ), and an angle in a range of 0-150 degrees is formed at a junction of the third groove ( 4 ) and each of the negative spiral logarithmic sub grooves of the second groove ( 3 ). 
     
     
         9 . The CMP composite groove polishing pad, as recited in  claim 1 , wherein: each of the positive spiral logarithmic sub grooves of the first groove ( 2 ), each of the negative spiral logarithmic sub grooves of the second groove ( 3 ), and the third groove ( 4 ) have a width in a range of 0.2 to 2.0 mm. 
     
     
         10 . The CMP composite groove polishing pad, as recited in  claim 2 , wherein: each of the positive spiral logarithmic sub grooves of the first groove ( 2 ), each of the negative spiral logarithmic sub grooves of the second groove ( 3 ), and the third groove ( 4 ) have a width in a range of 0.2 to 2.0 mm. 
     
     
         11 . The CMP composite groove polishing pad, as recited in  claim 4 , wherein: each of the positive spiral logarithmic sub grooves of the first groove ( 2 ), each of the negative spiral logarithmic sub grooves of the second groove ( 3 ), and the third groove ( 4 ) have a width in a range of 0.2 to 2.0 mm. 
     
     
         12 . The CMP composite groove polishing pad, as recited in  claim 1 , wherein: each of the first groove ( 2 ), the second groove ( 3 ) and the third groove ( 4 ) has a depth in a range of 0.5 to 2.5 mm. 
     
     
         13 . The CMP composite groove polishing pad, as recited in  claim 2 , wherein: each of the first groove ( 2 ), the second groove ( 3 ) and the third groove ( 4 ) has a depth in a range of 0.5 to 2.5 mm. 
     
     
         14 . The CMP composite groove polishing pad, as recited in  claim 4 , wherein: each of the first groove ( 2 ), the second groove ( 3 ) and the third groove ( 4 ) has a depth in a range of 0.5 to 2.5 mm. 
     
     
         15 . The CMP composite groove polishing pad, as recited in  claim 1 , wherein: there are at least two third grooves ( 4 ) which are at least two concentric annular grooves centered on the rotation center ( 101 ), respectively. 
     
     
         16 . The CMP composite groove polishing pad, as recited in  claim 2 , wherein: there are at least two third grooves ( 4 ) which are at least two concentric annular grooves centered on the rotation center ( 101 ), respectively. 
     
     
         17 . The CMP composite groove polishing pad, as recited in  claim 4 , wherein: there are at least two third grooves ( 4 ) which are at least two concentric annular grooves centered on the rotation center ( 101 ), respectively. 
     
     
         18 . The CMP composite groove polishing pad, as recited in  claim 11 , wherein: there are at least two third grooves ( 4 ) which are at least two concentric annular grooves centered on the rotation center ( 101 ), respectively. 
     
     
         19 . The CMP composite groove polishing pad, as recited in  claim 13 , wherein: there are at least two third grooves ( 4 ) which are at least two concentric annular grooves centered on the rotation center ( 101 ), respectively. 
     
     
         20 . The CMP composite groove polishing pad, as recited in  claim 14 , wherein: there are at least two third grooves ( 4 ) which are at least two concentric annular grooves centered on the rotation center ( 101 ), respectively.