Inventor · disambiguated record

Wern Ken Daryl Wee

Also filed as: DARYL WEE WERN KEN

4 granted patents·3 pending applications·0 citations·filing 2019–2025

55Inventor score

Technology areasH10W

Files withINFINEON TECHNOLOGIES AG7

Top patents by PatentIndex Score

7 records

0166US12278171B2Chip package and method of forming a chip packageINFINEON TECHNOLOGIES AG·Filed 2022·Granted Apr 15, 2025·0 cites·17 claims
0265US2025210478A1Chip package and method of forming a chip packageINFINEON TECHNOLOGIES AG·Filed 2025·Application pending·0 cites
0364US2025266311A1Methods for Manufacturing Semiconductor PackagesINFINEON TECHNOLOGIES AG·Filed 2025·Application pending·0 cites
0459US12300559B2Semiconductor packages and methods for manufacturing thereofINFINEON TECHNOLOGIES AG·Filed 2021·Granted May 13, 2025·0 cites·15 claims
0557US2023197585A1Semiconductor package interconnect and power connection by metallized structures on package bodyINFINEON TECHNOLOGIES AG·Filed 2021·Application pending·0 cites
0652US12176222B2Semiconductor package with metal posts from structured leadframeINFINEON TECHNOLOGIES AG·Filed 2021·Granted Dec 24, 2024·0 cites·20 claims
0742US10937744B2Semiconductor packages including roughening featuresINFINEON TECHNOLOGIES AG·Filed 2019·Granted Mar 2, 2021·0 cites·10 claims

Join the waitlist — get patent alerts

Get an alert when Wern Ken Daryl Wee files or is granted a new patent.

We store only your email — no account needed. See our privacy policy.

Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →